TU; JUNG-KUO
Patent Applications and Registrations
Patent applications and USPTO patent grants for TU; JUNG-KUO.The latest application filed is for "mems device and manufacturing method thereof".
Company Profile
5.20.23
- TU; JUNG-KUO - HSINCHU CITY TW
- Tu; Jung-Kuo - Hsinchu TW
- Tu; Jung-Kuo - Hsin-Chu TW
- Tu; Jung-Kuo - Hsin-Chu City TW
Patent Activity
| Patent | Date |
|---|---|
| Mems Device And Manufacturing Method Thereof App 20220141596 - LIN; WEI-CHU ; et al. | 2022-05-05 |
| Semiconductor device and manufacturing method of semiconductor device Grant 11,276,670 - Teng , et al. March 15, 2 | 2022-03-15 |
| Semiconductor Device And Manufacturing Method Of Semiconductor Device App 20210327852 - Teng; Yi-Chuan ; et al. | 2021-10-21 |
| Method of fabricating semiconductor structure Grant 11,097,941 - Chang , et al. August 24, 2 | 2021-08-24 |
| Semiconductor Structure And Manufacturing Method For The Same App 20210206627 - SHEN; CHING-KAI ; et al. | 2021-07-08 |
| Semiconductor structure and manufacturing method for the same Grant 10,961,114 - Shen , et al. March 30, 2 | 2021-03-30 |
| Semiconductor Device And Method For Manufacturing The Same App 20200381366 - SHEN; CHING-KAI ; et al. | 2020-12-03 |
| Semiconductor Structure And Manufacturing Method For The Same App 20200377362 - SHEN; CHING-KAI ; et al. | 2020-12-03 |
| Image sensor device and method Grant 10,510,912 - Huang , et al. Dec | 2019-12-17 |
| Method Of Fabricating Semiconductor Structure App 20190256347 - CHANG; Yi-Hsien ; et al. | 2019-08-22 |
| Image Sensor Device and Method App 20190140112 - Huang; Kuo-Chin ; et al. | 2019-05-09 |
| Substrate structure, semiconductor structure and method for fabricating the same Grant 10,273,140 - Chang , et al. | 2019-04-30 |
| Package structure and methods of forming same Grant 10,269,586 - Chou , et al. | 2019-04-23 |
| Image sensor device and method Grant 10,164,133 - Huang , et al. Dec | 2018-12-25 |
| Image Sensor Device and Method App 20170330979 - Huang; Kuo-Chin ; et al. | 2017-11-16 |
| Air trench in packages incorporating hybrid bonding Grant 9,786,628 - Chou , et al. October 10, 2 | 2017-10-10 |
| Image sensor device and method Grant 9,722,109 - Huang , et al. August 1, 2 | 2017-08-01 |
| Air Trench in Packages Incorporating Hybrid Bonding App 20170069593 - Chou; Bruce C.S. ; et al. | 2017-03-09 |
| Method of fabricating MEMS devices having a plurality of cavities Grant 9,561,954 - Cheng , et al. February 7, 2 | 2017-02-07 |
| Air trench in packages incorporating hybrid bonding Grant 9,502,396 - Chou , et al. November 22, 2 | 2016-11-22 |
| Air trench in packages incorporating hybrid bonding Grant 9,443,796 - Chou , et al. September 13, 2 | 2016-09-13 |
| Capacitive sensors and methods for forming the same Grant 9,422,155 - Chou , et al. August 23, 2 | 2016-08-23 |
| Image Sensor Device and Method App 20160233347 - Huang; Kuo-Chin ; et al. | 2016-08-11 |
| Substrate Structure, Semiconductor Structure And Method For Fabricating The Same App 20160207756 - CHANG; Yi-Hsien ; et al. | 2016-07-21 |
| Air Trench in Packages Incorporating Hybrid Bonding App 20160163684 - Chou; Bruce C.S. ; et al. | 2016-06-09 |
| Image sensor device and method Grant 9,318,528 - Huang , et al. April 19, 2 | 2016-04-19 |
| Image Sensor Device and Method App 20160035771 - Huang; Kuo-Chin ; et al. | 2016-02-04 |
| Capacitive Sensors and Methods for Forming the Same App 20150344297 - Chou; Bruce C.S. ; et al. | 2015-12-03 |
| Image sensor device and method Grant 9,159,852 - Huang , et al. October 13, 2 | 2015-10-13 |
| Capacitive sensors and methods for forming the same Grant 9,056,762 - Chou , et al. June 16, 2 | 2015-06-16 |
| Package Structure and Methods of Forming Same App 20150162220 - Chou; Bruce C.S. ; et al. | 2015-06-11 |
| Method Of Fabricating Mems Devices Having A Plurality Of Cavities App 20150104895 - Cheng; Shyh-Wei ; et al. | 2015-04-16 |
| Package structure and methods of forming same Grant 8,970,023 - Chou , et al. March 3, 2 | 2015-03-03 |
| MEMS devices having a plurality of cavities Grant 8,916,943 - Cheng , et al. December 23, 2 | 2014-12-23 |
| Air Trench in Packages Incorporating Hybrid Bonding App 20140264948 - Chou; Bruce C.S. ; et al. | 2014-09-18 |
| Image Sensor Device and Method App 20140264698 - Huang; Kuo-Chin ; et al. | 2014-09-18 |
| MEMS Structures and Methods of Forming the Same App 20140246708 - Cheng; Shyh-Wei ; et al. | 2014-09-04 |
| Package Structure and Methods of Forming Same App 20140217604 - Chou; Bruce C.S. ; et al. | 2014-08-07 |
| Capacitive Sensors and Methods for Forming the Same App 20140213008 - Chou; Bruce C.S. ; et al. | 2014-07-31 |
| Capacitive sensors and methods for forming the same Grant 8,748,999 - Chou , et al. June 10, 2 | 2014-06-10 |
| Capacitive Sensors and Methods for Forming the Same App 20130277771 - Chou; Bruce C.S. ; et al. | 2013-10-24 |
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