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Patent applications and USPTO patent grants for Tu; Jui-Neng.The latest application filed is for "dual damascene process for forming a multi-layer low-k dielectric interconnect".
Patent | Date |
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Dual damascene process for forming a multi-layer low-k dielectric interconnect Grant 7,285,489 - Tu October 23, 2 | 2007-10-23 |
Dual damascene process for forming a multi-layer low-K dielectric interconnect App 20050142853 - Tu, Jui-Neng | 2005-06-30 |
Dual damascene process for forming a multi-layer low-k dielectric interconnect App 20050130407 - Tu, Jui-Neng | 2005-06-16 |
Re-oxidation process of semiconductor device Grant 6,764,942 - Tu , et al. July 20, 2 | 2004-07-20 |
Re-oxidation Process Of Semiconductor Device App 20040106281 - Tu, Jui-Neng ;   et al. | 2004-06-03 |
Metallization process of in-situ forming titanium nitride and tungsten nitride in tungsten plug App 20020137356 - Huang, Chi Tung ;   et al. | 2002-09-26 |
Dual damascene semiconductor device and method App 20020090576 - Tu, Jui-Neng | 2002-07-11 |
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