Tu; Chia-Jung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tu; Chia-Jung.The latest application filed is for "method and device for compression bonding chip to substrate".
- Tu; Chia-Jung - Hsinchu City TW
- Tu; Chia-Jung - Hsinchu TW
- Tu; Chia-Jung - Hsinchu County TW
- Tu; Chia-Jung - Zhudong Township Hsinchu County TW
- Tu; Chia-Jung - Zhudong Township TW
| Patent | Date |
|---|---|
| Method And Device For Compression Bonding Chip To Substrate App 20210035947 - Hsieh; Chin-Tang ; et al. | 2021-02-04 |
| Method And Device For Compression Bonding Chip To Substrate App 20200105712 - Hsieh; Chin-Tang ; et al. | 2020-04-02 |
| Flexible substrate Grant 9,961,759 - Hsieh , et al. May 1, 2 | 2018-05-01 |
| Wafer Dicing Method App 20180090379 - Tu; Chia-Jung ; et al. | 2018-03-29 |
| Wafer dicing method Grant 9,929,051 - Tu , et al. March 27, 2 | 2018-03-27 |
| Flexible Substrate App 20170019984 - Hsieh; Chin-Tang ; et al. | 2017-01-19 |
| Flexible substrate Grant 9,510,441 - Hsieh , et al. November 29, 2 | 2016-11-29 |
| Flexible Substrate App 20160234927 - Hsieh; Chin-Tang ; et al. | 2016-08-11 |
| Semiconductor package structure and method for making the same Grant 9,159,660 - Hsieh , et al. October 13, 2 | 2015-10-13 |
| Semiconductor Package Process And Structure Thereof App 20140217578 - Ho; Lung-Hua ; et al. | 2014-08-07 |
| Semiconductor package and lead frame thereof Grant 8,704,345 - Kuo , et al. April 22, 2 | 2014-04-22 |
| Semiconductor package structure and method for making the same Grant 8,658,466 - Hsieh , et al. February 25, 2 | 2014-02-25 |
| Semiconductor Package Structure And Method For Making The Same App 20140027905 - Hsieh; Chin-Tang ; et al. | 2014-01-30 |
| Semiconductor Package Structure And Method For Making The Same App 20130334681 - Hsieh; Chin-Tang ; et al. | 2013-12-19 |
| Semiconductor Package And Lead Frame Thereof App 20130334671 - Kuo; Chih-Ming ; et al. | 2013-12-19 |
| Semiconductor package structure Grant 8,581,384 - Hsieh , et al. November 12, 2 | 2013-11-12 |
| Semiconductor Package Structure App 20130249070 - Hsieh; Chin-Tang ; et al. | 2013-09-26 |
| Thin flip chip package structure Grant 8,497,571 - Hsieh , et al. July 30, 2 | 2013-07-30 |
| Thin flip chip package structure Grant 8,471,372 - Hsieh , et al. June 25, 2 | 2013-06-25 |
| Thin Flip Chip Package Structure App 20120080783 - Hsieh; Chin-Tang ; et al. | 2012-04-05 |
| Thin Flip Chip Package Structure App 20120074545 - Hsieh; Chin-Tang ; et al. | 2012-03-29 |
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