Tu; Chi-Li
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tu; Chi-Li.The latest application filed is for "bonding pad structure having island portions and method for manufacturing the same".
- Tu; Chi-Li - Hsinchu County TW
- Tu; Chi-Li - Cyonglin Township Hsinchu County TW
| Patent | Date |
|---|---|
| Semiconductor structures Grant 10,692,969 - Lin , et al. | 2020-06-23 |
| Semiconductor structures Grant 10,692,786 - Lin , et al. | 2020-06-23 |
| Semiconductor device structures Grant 10,381,303 - Lin , et al. A | 2019-08-13 |
| Bonding pad structure having island portions and method for manufacturing the same Grant 10,256,201 - Tu , et al. | 2019-04-09 |
| Semiconductor device layout structure Grant 9,997,510 - Tu , et al. June 12, 2 | 2018-06-12 |
| Bonding Pad Structure Having Island Portions And Method For Manufacturing The Same App 20180122757 - TU; Chi-Li ; et al. | 2018-05-03 |
| Bonding pad structure having island portions and method for manufacturing the same Grant 9,929,114 - Tu , et al. March 27, 2 | 2018-03-27 |
| Semiconductor Device Structures App 20180005942 - LIN; Ting-You ; et al. | 2018-01-04 |
| Semiconductor Device Layout Structure App 20170069620 - TU; Chi-Li ; et al. | 2017-03-09 |
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