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name:-0.018769025802612
name:-0.012314081192017
name:-0.30638790130615
Tu; Che-Hao Patent Filings

Tu; Che-Hao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tu; Che-Hao.The latest application filed is for "hard mask removal method".

Company Profile
9.13.17
  • Tu; Che-Hao - Hsinchu TW
  • Tu; Che-Hao - Hsinchu City TW
  • Tu; Che-Hao - Hsin-Chu TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Hard Mask Removal Method
App 20210225657 - Tu; Che-Hao ;   et al.
2021-07-22
Forming Gate Line-end Of Semiconductor Structures
App 20210166972 - CHUNG; Che-Liang ;   et al.
2021-06-03
Hard mask removal method
Grant 10,971,370 - Tu , et al. April 6, 2
2021-04-06
Forming gate line-end of semiconductor structures
Grant 10,943,822 - Chung , et al. March 9, 2
2021-03-09
System and Method of Chemical Mechanical Polishing
App 20210023678 - Liu; Chih-Wen ;   et al.
2021-01-28
System and method of chemical mechanical polishing
Grant 10,800,004 - Liu , et al. October 13, 2
2020-10-13
Hard Mask Removal Method
App 20200118827 - Tu; Che-Hao ;   et al.
2020-04-16
System And Method Of Chemical Mechanical Polishing
App 20200101582 - Liu; Chih-Wen ;   et al.
2020-04-02
Zone-based Cmp Target Control
App 20200094369 - Chung; Che-Liang ;   et al.
2020-03-26
Hard mask removal method
Grant 10,510,552 - Tu , et al. Dec
2019-12-17
Forming Gate Line-end Of Semiconductor Structures
App 20190287852 - Chung; Che-Liang ;   et al.
2019-09-19
Hard Mask Removal Method
App 20180240679 - Tu; Che-Hao ;   et al.
2018-08-23
Hard mask removal method
Grant 9,960,050 - Tu , et al. May 1, 2
2018-05-01
Surface treatment in a chemical mechanical process
Grant 9,941,109 - Liu , et al. April 10, 2
2018-04-10
Asymmetric application of pressure to a wafer during a CMP process
Grant 9,922,837 - Liu , et al. March 20, 2
2018-03-20
Surface Treatment in a Chemical Mechanical Process
App 20180005840 - Liu; Chih-Wen ;   et al.
2018-01-04
Asymmetric Application of Pressure to a Wafer During a CMP Process
App 20170256414 - Liu; Chih-Wen ;   et al.
2017-09-07
Mechanisms for forming oxide layer over exposed polysilicon during a chemical mechanical polishing (CMP) process
Grant 9,711,374 - Tu , et al. July 18, 2
2017-07-18
Composite structure for gate level inter-layer dielectric
Grant 9,595,450 - Tu , et al. March 14, 2
2017-03-14
Composite Structure for Gate Level Inter-Layer Dielectric
App 20150187594 - Tu; Che-Hao ;   et al.
2015-07-02
Planarization process for semiconductor device fabrication
Grant 8,975,179 - Tu , et al. March 10, 2
2015-03-10
Hard Mask Removal Method
App 20150037978 - TU; CHE-HAO ;   et al.
2015-02-05
Mechanisms For Forming Oxide Layer Over Exposed Polysilicon During A Chemical Mechanical Polishing (cmp) Process
App 20140370696 - TU; Che-Hao ;   et al.
2014-12-18
Gate height loss improvement for a transistor
Grant 8,598,028 - Tu , et al. December 3, 2
2013-12-03
Gate Height Loss Improvement For A Transistor
App 20130164930 - Tu; Che-Hao ;   et al.
2013-06-27
Planarization Process For Semiconductor Device Fabrication
App 20130095644 - Tu; Che-Hao ;   et al.
2013-04-18

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