TSUYUTANI; Kazutoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for TSUYUTANI; Kazutoshi.The latest application filed is for "sensor package substrate, sensor module having the same, and sensor package substrate manufacturing method".

Company Profile

5.8.10

TSUYUTANI; Kazutoshi - Tokyo JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sensor Package Substrate, Sensor Module Having The Same, And Sensor Package Substrate Manufacturing Method App 20220267142 - TSUYUTANI; Kazutoshi ; et al.	2022-08-25
Circuit board and its manufacturing method Grant 11,393,761 - Tsuyutani , et al. July 19, 2	2022-07-19
Sensor package substrate and sensor module having the same Grant 11,053,118 - Tsuyutani , et al. July 6, 2	2021-07-06
Circuit board incorporating electronic component and manufacturing method thereof Grant 10,917,974 - Tsuyutani February 9, 2	2021-02-09
Circuit Board And Its Manufacturing Method App 20200203278 - TSUYUTANI; Kazutoshi ; et al.	2020-06-25
Semiconductor Ic-embedded Substrate And Its Manufacturing Method App 20200194375 - TSUYUTANI; Kazutoshi ; et al.	2020-06-18
Sensor Package Substrate, Sensor Module Including The Same, And Electronic Component Embedded Substrate App 20200161199 - TSUYUTANI; Kazutoshi ; et al.	2020-05-21
Sensor Package Substrate And Sensor Module Having The Same App 20200109047 - TSUYUTANI; Kazutoshi ; et al.	2020-04-09
Circuit board incorporating semiconductor IC and manufacturing method thereof Grant 10,515,898 - Tsuyutani , et al. Dec	2019-12-24
Circuit Board Incorporating Semiconductor Ic And Manufacturing Method Thereof App 20180337131 - Tsuyutani; Kazutoshi ; et al.	2018-11-22
Circuit board incorporating semiconductor IC and manufacturing method thereof Grant 9,635,756 - Tsuyutani , et al. April 25, 2	2017-04-25
IC embedded substrate and method of manufacturing the same Grant 9,153,553 - Tsuyutani , et al. October 6, 2	2015-10-06
Ic Embedded Substrate And Method Of Manufacturing The Same App 20150145145 - TSUYUTANI; Kazutoshi ; et al.	2015-05-28
Electronic component-embeded board and method for manufacturing the same Grant 8,779,299 - Tsuyutani , et al. July 15, 2	2014-07-15
Circuit Board Incorporating Electronic Component And Manufacturing Method Thereof App 20140104803 - TSUYUTANI; Kazutoshi	2014-04-17
Circuit Board Incorporating Semiconductor Ic And Manufacturing Method Thereof App 20140085854 - TSUYUTANI; Kazutoshi ; et al.	2014-03-27
Electronic Component-embeded Board And Method For Manufacturing The Same App 20120247819 - TSUYUTANI; Kazutoshi ; et al.	2012-10-04

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