| Patent | Date |
|---|
Power semiconductor device and manufacturing method of the same
Grant 11,367,670 - Tsuyuno June 21, 2 | 2022-06-21 |
Power semiconductor device
Grant 11,367,671 - Tsuyuno , et al. June 21, 2 | 2022-06-21 |
Semiconductor Device, Electric Power Conversion Device, And Manufacturing Method Of Semiconductor Device
App 20220166337 - IDE; Eiichi ; et al. | 2022-05-26 |
Power semiconductor device having a distance regulation portion and power conversion apparatus including the same
Grant 11,232,994 - Tsuyuno , et al. January 25, 2 | 2022-01-25 |
Semiconductor Module, Power Conversion Device, And Manufacturing Method Of Semiconductor Module
App 20210391236 - TSUYUNO; Nobutake ; et al. | 2021-12-16 |
Power Module
App 20210272882 - TSUYUNO; Nobutake ; et al. | 2021-09-02 |
Power Semiconductor Device And Manufacturing Method Of The Same
App 20200388556 - TSUYUNO; Nobutake | 2020-12-10 |
Power semiconductor module with heat dissipation plate
Grant 10,818,573 - Tsuyuno , et al. October 27, 2 | 2020-10-27 |
Power Semiconductor Device
App 20200294888 - TSUYUNO; Nobutake ; et al. | 2020-09-17 |
Power semiconductor module, power conversion device using same, and method for manufacturing power conversion device
Grant 10,763,190 - Tsuyuno , et al. Sep | 2020-09-01 |
Power Semiconductor Device and Power Conversion Apparatus Including the Same
App 20200227333 - TSUYUNO; Nobutake ; et al. | 2020-07-16 |
Resin-sealed vehicle-mounted control device
Grant 10,699,917 - Ito , et al. | 2020-06-30 |
Power Semiconductor Module, Power Conversion Device Using Same, And Method For Manufacturing Power Conversion Device
App 20190157185 - TSUYUNO; Nobutake ; et al. | 2019-05-23 |
Resin-sealed Vehicle-mounted Control Device
App 20190080931 - ITO; Maki ; et al. | 2019-03-14 |
Power conversion device
Grant 10,194,563 - Tsuyuno , et al. Ja | 2019-01-29 |
Internal combustion engine ignition coil and method for manufacturing internal combustion engine ignition coil
Grant 10,190,563 - Kamikawa , et al. Ja | 2019-01-29 |
Power module
Grant 10,186,473 - Hojo , et al. Ja | 2019-01-22 |
Semiconductor module and method of manufacturing semiconductor module
Grant 10,177,084 - Tsuyuno , et al. J | 2019-01-08 |
Electronic device and method of manufacturing the electronic device
Grant 10,128,164 - Temmei , et al. November 13, 2 | 2018-11-13 |
Structure
App 20180254235 - TSUYUNO; Nobutake ; et al. | 2018-09-06 |
Power module
Grant 10,068,880 - Tsuyuno , et al. September 4, 2 | 2018-09-04 |
Power Module
App 20180218963 - HOJO; Fusao ; et al. | 2018-08-02 |
Power Module
App 20180211938 - TSUYUNO; Nobutake ; et al. | 2018-07-26 |
Ignition Coil for Internal Combustion Engine
App 20180190425 - KAMIKAWA; Masayuki ; et al. | 2018-07-05 |
Waterproof electronic device and manufacturing method thereof
Grant 9,852,962 - Temmei , et al. December 26, 2 | 2017-12-26 |
Electronic Device
App 20170365536 - AMO; Mina ; et al. | 2017-12-21 |
Semiconductor Module And Method Of Manufacturing Semiconductor Module
App 20170338176 - TSUYUNO; Nobutake ; et al. | 2017-11-23 |
Electronic Device And Method Of Manufacturing The Electronic Device
App 20170309540 - TEMMEI; Hiroyuki ; et al. | 2017-10-26 |
Internal Combustion Engine Ignition Coil and Method for Manufacturing Internal Combustion Engine Ignition Coil
App 20170241393 - KAMIKAWA; Masayuki ; et al. | 2017-08-24 |
Power Conversion Device
App 20170223875 - TSUYUNO; NOBUTAKE ; et al. | 2017-08-03 |
Power semiconductor module and power module
Grant 9,591,789 - Ide , et al. March 7, 2 | 2017-03-07 |
Waterproof Electronic Device and Manufacturing Method Thereof
App 20160343636 - TEMMEI; Hiroyuki ; et al. | 2016-11-24 |
Power module including first and second sealing resins
Grant 9,497,873 - Takagi , et al. November 15, 2 | 2016-11-15 |
Resin-sealed electronic control device
Grant 9,373,558 - Tsuyuno , et al. June 21, 2 | 2016-06-21 |
Power module
Grant 9,326,425 - Suwa , et al. April 26, 2 | 2016-04-26 |
Resin-sealed Electronic Control Device
App 20160005671 - TSUYUNO; Nobutake ; et al. | 2016-01-07 |
Power Module
App 20150245523 - Takagi; Yusuke ; et al. | 2015-08-27 |
Semiconductor module and method for manufacturing semiconductor module
Grant 8,952,525 - Ide , et al. February 10, 2 | 2015-02-10 |
Power Semiconductor Module and Power Module
App 20150003019 - Ide; Eiichi ; et al. | 2015-01-01 |
Power semiconductor module and manufacturing method thereof
Grant 8,847,374 - Ide , et al. September 30, 2 | 2014-09-30 |
Semiconductor Module and Method for Manufacturing Semiconductor Module
App 20140197532 - Ide; Eiichi ; et al. | 2014-07-17 |
Power semiconductor unit, power module, power semiconductor unit manufacturing method, and power module manufacturing method
Grant 8,723,306 - Tsuyuno , et al. May 13, 2 | 2014-05-13 |
Semiconductor device, power semiconductor module and power conversion device equipped with power semiconductor module
Grant 8,653,652 - Tokuyama , et al. February 18, 2 | 2014-02-18 |
Power Module
App 20130279230 - Suwa; Tokihito ; et al. | 2013-10-24 |
Power Semiconductor Module and Manufacturing Method Thereof
App 20130175678 - Ide; Eiichi ; et al. | 2013-07-11 |
Power Semiconductor Unit, Power Module, Power Semiconductor Unit Manufacturing Method, and Power Module Manufacturing Method
App 20130119525 - Tsuyuno; Nobutake ; et al. | 2013-05-16 |
Transmission control apparatus and mechanically and electrically integrated type electronic control apparatus
Grant 8,339,795 - Tsuyuno , et al. December 25, 2 | 2012-12-25 |
Semiconductor Device, Power Semiconductor Module and Power Conversion Device Equipped with Power Semiconductor Module
App 20120300522 - Tokuyama; Takeshi ; et al. | 2012-11-29 |
Electronic control device using LC module structure
Grant 8,050,037 - Tsuyuno , et al. November 1, 2 | 2011-11-01 |
Transmission Control Apparatus and Mechanically and Electrically Integrated Type Electronic Control Apparatus
App 20110075334 - TSUYUNO; Nobutake ; et al. | 2011-03-31 |
Engine control unit
Grant 7,899,602 - Yoshinari , et al. March 1, 2 | 2011-03-01 |
Power module and motor integrated control unit
Grant 7,679,182 - Yoshinari , et al. March 16, 2 | 2010-03-16 |
Electronic Control Device Using Lc Module Structure
App 20090086437 - Tsuyuno; Nobutake ; et al. | 2009-04-02 |
Engine Control Unit
App 20080294324 - Yoshinari; Hideto ; et al. | 2008-11-27 |
Power Module and Motor Integrated Control Unit
App 20080106160 - Yoshinari; Hideto ; et al. | 2008-05-08 |
Electronic circuit device
Grant 7,298,039 - Tsuyuno , et al. November 20, 2 | 2007-11-20 |
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device
Grant 7,217,992 - Ogino , et al. May 15, 2 | 2007-05-15 |
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same
Grant 7,202,570 - Nagai , et al. April 10, 2 | 2007-04-10 |
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device
Grant 6,888,230 - Ogino , et al. May 3, 2 | 2005-05-03 |
Electronic circuit device
App 20050030823 - Tsuyuno, Nobutake ; et al. | 2005-02-10 |
Circuit tape having adhesive film semiconductor device and a method for manufacturing the same
App 20040224149 - Nagai, Akira ; et al. | 2004-11-11 |
Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device
App 20040217453 - Ogino, Masahiko ; et al. | 2004-11-04 |
Electronic circuit apparatus and method of manufacturing the same
App 20040212965 - Ishii, Toshiaki ; et al. | 2004-10-28 |
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
Grant 6,791,194 - Nagai , et al. September 14, 2 | 2004-09-14 |
Circuit tape having adhesive film, semiconductor device, and a method for manufacturing the same
App 20020160185 - Nagai, Akira ; et al. | 2002-10-31 |
Resin sealed semiconductor devices and a process for manufacturing the same
Grant 6,097,100 - Eguchi , et al. August 1, 2 | 2000-08-01 |
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