Tsuya; Hideki
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tsuya; Hideki.The latest application filed is for "method for manufacturing soi substrate".
- Tsuya; Hideki - Yokohama N/A JP
- Tsuya; Hideki - Kanagawa N/A JP
- Tsuya; Hideki - Okazaki JP
- Tsuya, Hideki - Okazaki-shi JP
- Tsuya, Hideki - Yokohama City JP
| Patent | Date |
|---|---|
| Method of manufacturing SOI substrate Grant 8,486,772 - Hanaoka , et al. July 16, 2 | 2013-07-16 |
| Method for manufacturing SOI substrate Grant 8,367,517 - Hanaoka , et al. February 5, 2 | 2013-02-05 |
| Method For Manufacturing Soi Substrate App 20130023108 - HANAOKA; Kazuya ; et al. | 2013-01-24 |
| Method Of Manufacturing Soi Substrate App 20120208348 - HANAOKA; Kazuya ; et al. | 2012-08-16 |
| Method of manufacturing SOI substrate Grant 8,168,481 - Hanaoka , et al. May 1, 2 | 2012-05-01 |
| Method For Manufacturing Soi Substrate App 20110183445 - HANAOKA; Kazuya ; et al. | 2011-07-28 |
| Method Of Manufacturing Soi Substrate App 20100273310 - HANAOKA; Kazuya ; et al. | 2010-10-28 |
| Joint structure Grant 7,360,964 - Tsuya , et al. April 22, 2 | 2008-04-22 |
| Method for removing impurities of a semiconductor wafer, semiconductor wafer assembly, and semiconductor device Grant 7,126,194 - Kishino , et al. October 24, 2 | 2006-10-24 |
| Joint structure App 20050054229 - Tsuya, Hideki ; et al. | 2005-03-10 |
| Method for removing impurities of a semiconductor wafer, semiconductor wafer assembly, and semiconductor device App 20040150087 - Kishino, Seigo ; et al. | 2004-08-05 |
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