loadpatents
Patent applications and USPTO patent grants for Tsutsumi; Hideyuki.The latest application filed is for "device attachment member".
Patent | Date |
---|---|
Manufacture work machine for controlling a plurality of work-element performing apparatuses by central control device Grant 10,098,269 - Kodama , et al. October 9, 2 | 2018-10-09 |
Device attachment member Grant 9,291,302 - Iwaki , et al. March 22, 2 | 2016-03-22 |
Device Attachment Member App 20130306811 - Iwaki; Noriaki ;   et al. | 2013-11-21 |
Manufacture Work Machine App 20130046402 - Kodama; Seigo ;   et al. | 2013-02-21 |
Method of controlling header compression in wireless communication, wireless base station, and transmitter Grant 8,189,594 - Nakatsuji , et al. May 29, 2 | 2012-05-29 |
Resin composition and flexible printed circuit board Grant 7,737,207 - Kawaguchi , et al. June 15, 2 | 2010-06-15 |
Method Of Controlling Header Compression In Wireless Communication, Wireless Base Station, And Transmitter App 20100039942 - Nakatsuji; Mitsuru ;   et al. | 2010-02-18 |
Resin Composition And Flexible Printed Circuit Board App 20090159847 - Kawaguchi; Akiyoshi ;   et al. | 2009-06-25 |
Resin composition and flexible printed circuit board App 20080099725 - Kawaguchi; Akiyoshi ;   et al. | 2008-05-01 |
Resin composition and flexible printed circuit board Grant 7,361,705 - Kawaguchi , et al. April 22, 2 | 2008-04-22 |
Substrate processing apparatus for resist film removal App 20070204885 - Toshima; Takayuki ;   et al. | 2007-09-06 |
Resource assigning method and diagnostic system of arithmetic circuit using the same App 20070136732 - Saitoh; Hiroyuki ;   et al. | 2007-06-14 |
Resin composition for reflecting plates App 20070066736 - Tsutsumi; Hideyuki ;   et al. | 2007-03-22 |
Substrate processing apparatus for resist film removal Grant 7,191,785 - Toshima , et al. March 20, 2 | 2007-03-20 |
Resin composition for reflecting plate App 20050131121 - Tsutsumi, Hideyuki ;   et al. | 2005-06-16 |
Substrate processing method and apparatus App 20050011537 - Toshima, Takayuki ;   et al. | 2005-01-20 |
Resin composition, molded object thereof, and use thereof App 20030181560 - Kawaguchi, Akiyoshi ;   et al. | 2003-09-25 |
Substrate processing method and apparatus Grant 6,613,692 - Toshima , et al. September 2, 2 | 2003-09-02 |
Resin composition and flexible printed circuit board App 20030078333 - Kawaguchi, Akiyoshi ;   et al. | 2003-04-24 |
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