Tsuruta; Kaichi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsuruta; Kaichi.The latest application filed is for "solder ball, solder joint, and joining method".

Company Profile

6.24.22

Tsuruta; Kaichi - Tochigi JP
TSURUTA; Kaichi - Tokyo JP
Tsuruta; Kaichi - Tochigi-ken JP
Tsuruta; Kaichi - Haga-gun, Tochigi N/A JP
Tsuruta; Kaichi - Haga-gun JP
Tsuruta; Kaichi - Mouka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Solder ball, solder joint, and joining method Grant 10,780,530 - Oshima , et al. Sept	2020-09-22
Solder ball, solder joint, and joining method Grant 10,780,531 - Kawasaki , et al. Sept	2020-09-22
Solder ball supplying method, solder ball supplying device, and solder bump forming method Grant 10,722,965 - Tsuruta , et al.	2020-07-28
Joining member, solder material, solder paste, formed solder, flux coated material, and solder joint Grant 10,675,719 - Kawasaki , et al.	2020-06-09
Solder Ball, Solder Joint, and Joining Method App 20200147732 - Kawasaki; Hiroyoshi ; et al.	2020-05-14
Solder Ball, Solder Joint, and Joining Method App 20190358752 - Oshima; Hiroki ; et al.	2019-11-28
Solder Alloy For Bonding Cu Pipes And/or Fe Pipes, Preform Solder, Resin Flux Cored Solder, And Solder Joint App 20190358751 - KAMEDA; Naoto ; et al.	2019-11-28
Flux applying device Grant 10,391,589 - Muraoka , et al. A	2019-08-27
Flux for resin flux cored solder, flux for flux coated solder, resin flux cored solder and flux coated solder Grant 10,265,808 - Onitsuka , et al.	2019-04-23
Liquid coating device Grant 10,137,538 - Muraoka , et al. November 27, 2	2018-11-27
Method of manufacturing an electrode for an energy storage device Grant 10,121,606 - Nakamura , et al. November 6, 2	2018-11-06
Solder transfer sheet, solder bump, and solder precoating method using solder transfer sheet Grant 10,111,342 - Tsuruta , et al. October 23, 2	2018-10-23
Solder preform and a process for its manufacture Grant 10,081,852 - Hirano , et al. September 25, 2	2018-09-25
Flux Applying Device and Solder App 20180185967 - Muraoka; Manabu ; et al.	2018-07-05
Joining Member, Solder Material, Solder Paste, Formed Solder, Flux Coated Material, and Solder Joint App 20180015572 - Kawasaki; Hiroyoshi ; et al.	2018-01-18
Solder Alloy For Plating And Electronic Component App 20170348805 - TSURUTA; Kaichi ; et al.	2017-12-07
Solder Transfer Sheet, Solder Bump, and Solder Precoating Method Using Solder Transfer Sheet App 20170354042 - Tsuruta; Kaichi ; et al.	2017-12-07
Solder precoating method and workpiece for electronic equipment Grant 9,821,397 - Kuramoto , et al. November 21, 2	2017-11-21
Liquid Coating Device App 20160346878 - Muraoka; Manabu ; et al.	2016-12-01
Solder Ball Supplying Method, Solder Ball Supplying Device, and Solder Bump Forming Method App 20160271715 - Tsuruta; Kaichi ; et al.	2016-09-22
Method Of Manufacturing An Electrode For An Energy Storage Device App 20160254103 - Nakamura; Katsuji ; et al.	2016-09-01
Solder Transfer Sheet App 20160250719 - Tsuruta; Kaichi ; et al.	2016-09-01
Flux for Resin Flux Cored Solder, Flux for Flux Coated Solder, Resin Flux Cored Solder and Flux Coated Solder App 20160184937 - Onitsuka; Motohiro ; et al.	2016-06-30
Method of manufacturing an electrode for an energy storage device Grant 9,368,249 - Nakamura , et al. June 14, 2	2016-06-14
Solder paste Grant 8,961,709 - Takaura , et al. February 24, 2	2015-02-24
Flux for Flux-cored Solder, and Flux-cored Solder App 20150000792 - Sugiura; Takao ; et al.	2015-01-01
Solder bump formation on a circuit board using a transfer sheet Grant 8,701,973 - Kuramoto , et al. April 22, 2	2014-04-22
Electrode For Energy Storage Device, Manufacturing Method Thereof And Connecting Method Thereof App 20130133924 - Nakamura; Katsuji ; et al.	2013-05-30
Solder Bump Formation On A Circuit Board Using A Transfer Sheet App 20110297433 - Kuramoto; Takeo ; et al.	2011-12-08
Solder preform and a process for its manufacture App 20110068149 - Hirano; Naohiko ; et al.	2011-03-24
Solder preform and electronic component Grant 7,800,230 - Hirano , et al. September 21, 2	2010-09-21
Solder preform and a process for its manufacture Grant 7,793,820 - Hirano , et al. September 14, 2	2010-09-14
Solder Preform and Electronic Component App 20090236725 - Hirano; Naohiko ; et al.	2009-09-24
Solder preform and a process for its manufacture App 20080237301 - Hirano; Naohiko ; et al.	2008-10-02
Solder Precoating Method and Workpiece For Electronic Equipment App 20080213613 - Kuramoto; Takeo ; et al.	2008-09-04
Solder ball assembly for bump formation and method for its manufacture Grant 7,112,888 - Kuramoto , et al. September 26, 2	2006-09-26
Solder ball assembly, a method for its manufacture, and a method of forming solder bumps Grant 6,919,634 - Kuramoto , et al. July 19, 2	2005-07-19
Solder ball assembly for bump formation and method for its manufacture App 20040145064 - Kuramoto, Takeo ; et al.	2004-07-29
Solder ball assembly, a method for its manufacture, and a method of forming solder bumps App 20040070084 - Kuramoto, Takeo ; et al.	2004-04-15
Vacuum drying apparatus Grant 5,377,425 - Kawakami , et al. January 3, 1	1995-01-03

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