loadpatents
name:-0.033029079437256
name:-0.03013014793396
name:-0.00054311752319336
Tsuruta; Hideyoshi Patent Filings

Tsuruta; Hideyoshi

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsuruta; Hideyoshi.The latest application filed is for "wafer holder and method for manufacturing the same".

Company Profile
0.27.26
  • Tsuruta; Hideyoshi - Tokai JP
  • TSURUTA; Hideyoshi - Tokai-City JP
  • TSURUTA; Hideyoshi - Tokai-Shi JP
  • Tsuruta; Hideyoshi - Tohkai JP
  • Tsuruta; Hideyoshi - Toukai JP
  • Tsuruta, Hideyoshi - Toukai-shi JP
  • Tsuruta; Hideyoshi - Nagoya JP
  • Tsuruta, Hideyoshi - Tohkai-city JP
  • Tsuruta, Hideyoshi - Nagoya City JP
  • Tsuruta, Hideyoshi - Toukai-city JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Wafer holder and method for manufacturing the same
Grant 10,037,910 - Yanoh , et al. July 31, 2
2018-07-31
Wafer Holder And Method For Manufacturing The Same
App 20160196999 - YANOH; Takuya ;   et al.
2016-07-07
Heating device
Grant 7,763,831 - Morioka , et al. July 27, 2
2010-07-27
Power-supplying member and heating apparatus using the same
Grant 7,679,034 - Goto , et al. March 16, 2
2010-03-16
Plasma processing member
Grant 7,582,184 - Tomita , et al. September 1, 2
2009-09-01
Electrostatic chuck
Grant 7,576,967 - Morioka , et al. August 18, 2
2009-08-18
Heating Apparatus
App 20090159588 - Morioka; Ikuhisa ;   et al.
2009-06-25
Power-supplying member and heating apparatus using the same
Grant 7,525,071 - Goto , et al. April 28, 2
2009-04-28
Electrostatic chuck
Grant 7,403,386 - Aihara , et al. July 22, 2
2008-07-22
Heating Device
App 20080142501 - MORIOKA; Ikuhisa ;   et al.
2008-06-19
Electrostatic Chuck
App 20070223175 - Morioka; Ikuhisa ;   et al.
2007-09-27
Substrate heating apparatus
Grant 7,247,819 - Goto , et al. July 24, 2
2007-07-24
Substrate heating apparatus and manufacturing method for the same
Grant 7,247,818 - Kondou , et al. July 24, 2
2007-07-24
Electrostatic Chuck
App 20070146961 - Morioka; Ikuhisa ;   et al.
2007-06-28
Systems for producing semiconductors and members therefor
Grant 7,220,320 - Goto , et al. May 22, 2
2007-05-22
Substrate heating device
Grant 7,189,946 - Goto , et al. March 13, 2
2007-03-13
Systems for producing semiconductors and members therefor
Grant 7,157,666 - Goto , et al. January 2, 2
2007-01-02
Electrostatic chuck
App 20060279899 - Aihara; Yasufumi ;   et al.
2006-12-14
Power-supplying member and heating apparatus using the same
App 20060237442 - Goto; Yoshinobu ;   et al.
2006-10-26
Heating systems
Grant 7,126,093 - Goto , et al. October 24, 2
2006-10-24
Power-supplying member and heating apparatus using the same
App 20060231034 - Goto; Yoshinobu ;   et al.
2006-10-19
Plasma processing member
App 20060191879 - Tomita; Yasumitsu ;   et al.
2006-08-31
Heating Systems
App 20060186109 - Goto; Yoshinobu ;   et al.
2006-08-24
Joined bodies and a method of producing the same
Grant 7,067,200 - Fujii , et al. June 27, 2
2006-06-27
Substrate heater and fabrication method for the same
Grant 7,060,945 - Kondou , et al. June 13, 2
2006-06-13
Heating systems
Grant 7,044,399 - Goto , et al. May 16, 2
2006-05-16
Electrostatic chucks and electrostatically attracting structures
Grant 7,042,697 - Tsuruta , et al. May 9, 2
2006-05-09
Systems for supporting ceramic susceptors
Grant 7,022,947 - Yamaguchi , et al. April 4, 2
2006-04-04
Substrate heating apparatus and manufacturing method for the same
App 20060011610 - Kondou; Nobuyuki ;   et al.
2006-01-19
Substrate heating apparatus
App 20060011611 - Goto; Yoshinobu ;   et al.
2006-01-19
Substrate heating device
App 20050258160 - Goto, Yoshinobu ;   et al.
2005-11-24
Substrate heater and fabrication method for the same
App 20050082274 - Kondou, Nobuyuki ;   et al.
2005-04-21
Systems for supporting ceramic susceptors
App 20050006374 - Yamaguchi, Kazuaki ;   et al.
2005-01-13
Aluminum nitride sintered bodies and members for semiconductor-producing apparatuses
Grant 6,800,576 - Katsuda , et al. October 5, 2
2004-10-05
Heating systems
App 20040177812 - Goto, Yoshinobu ;   et al.
2004-09-16
Electrostatic chuck and substrate processing apparatus
Grant 6,785,115 - Tsuruta , et al. August 31, 2
2004-08-31
Systems for producing semiconductors and members therefor
App 20040144767 - Goto, Yoshinobu ;   et al.
2004-07-29
Systems for producing semiconductors and members therefor
App 20040144312 - Goto, Yoshinobu ;   et al.
2004-07-29
Electrostatic adsorption device
Grant 6,728,091 - Tsuruta , et al. April 27, 2
2004-04-27
Electrostatic chucks and electrostatically attracting structures
App 20040070916 - Tsuruta, Hideyoshi ;   et al.
2004-04-15
Joined bodies and a method of producing the same
App 20040016792 - Fujii, Tomoyuki ;   et al.
2004-01-29
Electrostatic chucks and process for producing the same
Grant 6,636,413 - Tsuruta October 21, 2
2003-10-21
Ceramics joint structure and method of producing the same
Grant 6,617,514 - Ushikoshi , et al. September 9, 2
2003-09-09
Electrostatic chunks
Grant 6,608,745 - Tsuruta , et al. August 19, 2
2003-08-19
Electrostatic chucks
App 20030095370 - Tsuruta, Hideyoshi ;   et al.
2003-05-22
Electrostatic adsorption device
App 20030059627 - Tsuruta, Hideyoshi ;   et al.
2003-03-27
Aluminum nitride sintered bodies and members for semiconductor-producing apparatuses
App 20020165079 - Katsuda, Yuji ;   et al.
2002-11-07
Electrostatic chuck and substrate processing apparatus
App 20020159217 - Tsuruta, Hideyoshi ;   et al.
2002-10-31
Electrostatic chucks and process for producing the same
App 20020109954 - Tsuruta, Hideyoshi
2002-08-15
Electrostatic chucks and electrostatically adsorbing structures
App 20020012219 - Tsuruta, Hideyoshi ;   et al.
2002-01-31
Joint structure of metal member and ceramic member and method of producing the same
Grant 6,057,513 - Ushikoshi , et al. May 2, 2
2000-05-02
Ceramic susceptor with embedded metal electrode and brazing material connection
Grant 5,817,406 - Cheung , et al. October 6, 1
1998-10-06
Ceramics joined body and method of joining ceramics
Grant 5,794,838 - Ushikoshi , et al. August 18, 1
1998-08-18

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