Tsuruga; Daisuke
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tsuruga; Daisuke.The latest application filed is for "component-embedded substrate".
- Tsuruga; Daisuke - Nagaokakyo JP
- TSURUGA; Daisuke - Nagaokakyo-shi JP
| Patent | Date |
|---|---|
| Resin multilayer substrate and method of manufacturing the same Grant 10,362,672 - Otsubo , et al. | 2019-07-23 |
| Component-embedded substrate Grant 10,028,388 - Tago , et al. July 17, 2 | 2018-07-17 |
| Production method of component-embedded substrate, and component-embedded substrate Grant 9,730,322 - Wakabayashi , et al. August 8, 2 | 2017-08-08 |
| Component-embedded Substrate App 20170156214 - TAGO; Shigeru ; et al. | 2017-06-01 |
| Resin Multilayer Substrate And Method Of Manufacturing The Same App 20170034911 - OTSUBO; Yoshihito ; et al. | 2017-02-02 |
| Production Method Of Component-embedded Substrate, And Component-embedded Substrate App 20160029489 - WAKABAYASHI; Yuki ; et al. | 2016-01-28 |
| Joining Method, Joint Structure And Method For Producing The Same App 20140356055 - Nakano; Kosuke ; et al. | 2014-12-04 |
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