TSUNO; Takeshi
Patent Applications and Registrations
Patent applications and USPTO patent grants for TSUNO; Takeshi.The latest application filed is for "room-temperature bonding apparatus".
- TSUNO; Takeshi - Tokyo JP
- Tsuno; Takeshi - Kanagawa N/A JP
- Tsuno; Takeshi - Yokohama N/A JP
- TSUNO; Takeshi - Yokohama-shi JP
- Tsuno; Takeshi - Ykohama-shi JP
| Patent | Date |
|---|---|
| Room-temperature Bonding Apparatus App 20170162428 - KINOUCHI; Masato ; et al. | 2017-06-08 |
| Room temperature bonding apparatus and room temperature bonding method Grant 9,580,306 - Kinouchi , et al. February 28, 2 | 2017-02-28 |
| Room-temperature bonding apparatus Grant 9,443,711 - Kinouchi , et al. September 13, 2 | 2016-09-13 |
| Room-temperature Bonded Device, Wafer Having Room-temperature Bonded Device, And Room-temperature Bonding Method App 20150294900 - Goto; Takayuki ; et al. | 2015-10-15 |
| Room Temperature Bonding Apparatus And Room Temperature Bonding Method App 20150251904 - Kinouchi; Masato ; et al. | 2015-09-10 |
| Wafer bonding device and wafer bonding method Grant 9,130,000 - Tsuno , et al. September 8, 2 | 2015-09-08 |
| Room-temperature Bonding Apparatus And Room-temperature Bonding Method App 20150249026 - Tsuno; Takeshi ; et al. | 2015-09-03 |
| Bonding unit control unit and multi-layer bonding method Grant 9,064,910 - Kinouchi , et al. June 23, 2 | 2015-06-23 |
| Room temperature bonding apparatus Grant 9,005,390 - Tsuno , et al. April 14, 2 | 2015-04-14 |
| Room temperature bonding machine and room temperature bonding method Grant 8,985,175 - Kinouchi , et al. March 24, 2 | 2015-03-24 |
| Room temperature bonding apparatus Grant 8,906,175 - Kinouchi , et al. December 9, 2 | 2014-12-09 |
| Room temperature bonding apparatus Grant 8,857,487 - Tsuno , et al. October 14, 2 | 2014-10-14 |
| Room-temperature Bonding Apparatus App 20140224405 - Kinouchi; Masato ; et al. | 2014-08-14 |
| Room Temperature Bonding Apparatus And Room Temperature Bonding Method App 20130112334 - Tsuno; Takeshi ; et al. | 2013-05-09 |
| Room Temperature Bonding Apparatus App 20120285624 - TSUNO; Takeshi ; et al. | 2012-11-15 |
| Bonding Method, Bonding Apparatus, And Bonding System App 20120247645 - Tsutsumi; Keiichiro ; et al. | 2012-10-04 |
| Bonding Unit Control Unit And Multi-layer Bonding Method App 20120031557 - Kinouchi; Masato ; et al. | 2012-02-09 |
| Room Temperature Bonding Apparatus App 20110277904 - Kinouchi; Masato ; et al. | 2011-11-17 |
| Wafer Bonding Device And Wafer Bonding Method App 20110207291 - Tsuno; Takeshi ; et al. | 2011-08-25 |
| Room Temperature Bonding Machine And Room Temperature Bonding Method App 20110083801 - Kinouchi; Masato ; et al. | 2011-04-14 |
| Room Temperature Bonding Apparatus App 20110011536 - Tsuno; Takeshi ; et al. | 2011-01-20 |
| Method Of Manufacturing Microstructure And Manufacturing System For The Same App 20070256774 - Tsuno; Takeshi ; et al. | 2007-11-08 |
| Manufacturing system for microstructure App 20050229737 - Tsuno, Takeshi ; et al. | 2005-10-20 |
| Method of manufacturing microstructure and manufacturing system for the same App 20050233064 - Tsuno, Takeshi ; et al. | 2005-10-20 |
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