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Patent applications and USPTO patent grants for TSUKUDA; Tatsuaki.The latest application filed is for "electronic device".
Patent | Date |
---|---|
Electronic Device App 20200412245 - TSUKUDA; Tatsuaki | 2020-12-31 |
Electronic device Grant 10,811,344 - Tsukuda October 20, 2 | 2020-10-20 |
Electronic device Grant 10,638,600 - Tsukuda , et al. | 2020-04-28 |
Electronic Device App 20190333866 - TSUKUDA; Tatsuaki | 2019-10-31 |
Loop antenna and communication control device Grant 10,205,237 - Tsukuda , et al. Feb | 2019-02-12 |
Electronic device Grant 10,165,673 - Tsukuda Dec | 2018-12-25 |
Electronic Device App 20180295715 - TSUKUDA; Tatsuaki ;   et al. | 2018-10-11 |
Electronic Device App 20180263108 - TSUKUDA; Tatsuaki | 2018-09-13 |
Electronic device for communication Grant 10,044,195 - Tsukuda , et al. August 7, 2 | 2018-08-07 |
Loop Antenna And Communication Control Device App 20170207535 - TSUKUDA; Tatsuaki ;   et al. | 2017-07-20 |
Communication control device and mounting board Grant 9,705,363 - Shibuya , et al. July 11, 2 | 2017-07-11 |
Communication Control Device And Mounting Board App 20160156231 - SHIBUYA; Hiroki ;   et al. | 2016-06-02 |
Electronic Device For Communication App 20160064823 - Tsukuda; Tatsuaki ;   et al. | 2016-03-03 |
Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring Grant 8,363,421 - Tsukuda , et al. January 29, 2 | 2013-01-29 |
Semiconductor device including wiring excellent in impedance matching, and method for designing the same Grant 8,089,004 - Tsukuda , et al. January 3, 2 | 2012-01-03 |
Electronic Device App 20110074042 - TSUKUDA; Tatsuaki | 2011-03-31 |
Semiconductor device having wiring formed on wiring board and electric conductor formed in wiring board and conductor chip formed over wiring App 20090244869 - Tsukuda; Tatsuaki ;   et al. | 2009-10-01 |
Semiconductor device including wiring excellent in impedance matching, and method for designing the same App 20090084592 - Tsukuda; Tatsuaki ;   et al. | 2009-04-02 |
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