Tsukano; Jun

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsukano; Jun.The latest application filed is for "method of manufacturing electronic module, method of manufacturing optical module, electronic module, optical module, and device".

Company Profile

1.12.15

Tsukano; Jun - Tokyo JP
Tsukano; Jun - Hino-shi JP
Tsukano; Jun - Kanagawa JP
Tsukano; Jun - Kawasaki-shi JP
Tsukano; Jun - Kawasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of manufacturing electronic module, method of manufacturing optical module, electronic module, optical module, and device Grant 11,448,914 - Tsukano September 20, 2	2022-09-20
Method Of Manufacturing Electronic Module, Method Of Manufacturing Optical Module, Electronic Module, Optical Module, And Device App 20210132431 - Tsukano; Jun	2021-05-06
Electronic Component Including Electronic Substrate And Circuit Member, Apparatus, And Camera App 20200296271 - Tsukano; Jun	2020-09-17
Method of manufacturing a wiring board Grant 8,389,414 - Kikuchi , et al. March 5, 2	2013-03-05
Method for manufacturing electronic device and electronic device Grant 8,304,918 - Tsukano November 6, 2	2012-11-06
Method for manufacturing electronic device and electronic device App 20110163458 - Tsukano; Jun	2011-07-07
Method Of Manufacturing A Wiring Board App 20110136298 - KIKUCHI; Katsumi ; et al.	2011-06-09
Wiring board, semiconductor device using wiring board and their manufacturing methods Grant 7,911,038 - Kikuchi , et al. March 22, 2	2011-03-22
Semiconductor device and method of manufacturing the same Grant 7,888,809 - Miyagawa , et al. February 15, 2	2011-02-15
Wiring board, method for manufacturing same, and semiconductor package Grant 7,838,779 - Yamamichi , et al. November 23, 2	2010-11-23
Wiring Board Composite Body, Semiconductor Device, And Method For Manufacturing The Wiring Board Composite Body And The Semiconductor Device App 20100232127 - Mori; Kentaro ; et al.	2010-09-16
Electronic device App 20100176517 - Miyagawa; Yuichi ; et al.	2010-07-15
Interconnecting substrate and semiconductor device Grant 7,745,736 - Ogawa , et al. June 29, 2	2010-06-29
Semiconductor device and method of manufacturing the same App 20100102461 - Miyagawa; Yuichi ; et al.	2010-04-29
Method of manufacturing a wiring substrate and semiconductor device Grant 7,701,726 - Tsukano , et al. April 20, 2	2010-04-20
Wiring board and method for manufacturing the same Grant 7,674,989 - Kikuchi , et al. March 9, 2	2010-03-09
Wiring substrate, semiconductor device, and method of manufacturing the same Grant 7,649,749 - Tsukano , et al. January 19, 2	2010-01-19
Wiring Board, Semiconductor Device Using Wiring Board And Their Manufacturing Methods App 20090315190 - Kikuchi; Katsumi ; et al.	2009-12-24
Method Of Manufacturing A Wiring Substrate And Semiconductor Device App 20090137085 - TSUKANO; Jun ; et al.	2009-05-28
Wiring substrate, semiconductor device, and method of manufacturing the same App 20080012140 - Tsukano; Jun ; et al.	2008-01-17
Wiring board, method for manufacturing same, and semiconductor package App 20060283625 - Yamamichi; Shintaro ; et al.	2006-12-21
Wiring board and method for manufacturing the same App 20060283629 - Kikuchi; Katsumi ; et al.	2006-12-21
Interconnecting substrate and semiconductor device App 20060192287 - Ogawa; Kenta ; et al.	2006-08-31
Light thin stacked package semiconductor device and process for fabrication thereof Grant 6,762,488 - Maeda , et al. July 13, 2	2004-07-13
Light thin stacked package semiconductor device and process for fabrication thereof App 20030178716 - Maeda, Takehiko ; et al.	2003-09-25
Semiconductor device and manufacturing method for the same App 20030119296 - Tsukano, Jun ; et al.	2003-06-26

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