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name:-0.014985084533691
name:-0.01746392250061
name:-0.00052809715270996
Tsukada; Yutaka Patent Filings

Tsukada; Yutaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsukada; Yutaka.The latest application filed is for "via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide".

Company Profile
0.18.12
  • Tsukada; Yutaka - Tokyo JP
  • Tsukada; Yutaka - Shiga JP
  • Tsukada; Yutaka - Yasu N/A JP
  • Tsukada; Yutaka - Yasu-shi JP
  • Tsukada; Yutaka - Shiga-ken JP
  • Tsukada, Yutaka - Kosei-cho JP
  • Tsukada; Yutaka - Ebetsu JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide
Grant 9,772,462 - Noma , et al. September 26, 2
2017-09-26
Via For Electrical Contact Passing Through Layers Of Optical Waveguide In Multilayer Structure Including Electrical Substrate And Laminated Layers Of Optical Waveguide
App 20160246017 - Noma; Hirokazu ;   et al.
2016-08-25
Via for electrical contact passing through layers of optical waveguide in multilayer structure including electrical substrate and laminated layers of optical waveguide
Grant 9,354,408 - Noma , et al. May 31, 2
2016-05-31
Via For Electrical Contact Passing Through Layers Of Optical Waveguide In Multilayer Structure Including Electrical Substrate And Laminated Layers Of Optical Waveguide
App 20150338589 - Noma; Hirokazu ;   et al.
2015-11-26
Spacer resin pattern helping to reduce optical coupling loss in optical waveguide for light-emitting element or light-receiving element on semiconductor
Grant 8,971,678 - Nakano , et al. March 3, 2
2015-03-03
Design For Spacer Resin Pattern Helping to Reduce Optical Coupling Loss in Optical Waveguide For Light-Emitting Element or Light-Receiving Element on Semiconductor
App 20130301986 - Nakano; Daiju ;   et al.
2013-11-14
Circuit board and mounting structure
Grant 8,446,734 - Hayashi , et al. May 21, 2
2013-05-21
Circuit board, mounting structure, and method for manufacturing circuit board
Grant 8,284,557 - Tsukada , et al. October 9, 2
2012-10-09
Resin film, adhesive sheet, circuit board, and electronic apparatus
Grant 8,129,623 - Nagasawa , et al. March 6, 2
2012-03-06
Optical waveguide member, optical wiring board, optical wiring module and method for manufacturing optical waveguide member and optical wiring board
Grant 8,045,829 - Hayashi , et al. October 25, 2
2011-10-25
Circuit Board and Mounting Structure
App 20100259910 - Hayashi; Katsura ;   et al.
2010-10-14
Circuit Board, Mounting Structure, and Method for Manufacturing Circuit Board
App 20100254098 - Tsukada; Yutaka ;   et al.
2010-10-07
Optical Waveguide Member, Optical Wiring Board, Optical Wiring Module And Method For Manufacturing Optical Waveguide Member And Optical Wiring Board
App 20100061679 - Hayashi; Katsura ;   et al.
2010-03-11
Resin Film, Adhesive Sheet, Circuit Board, and Electronic Apparatus
App 20090314526 - Nagasawa; Tadashi ;   et al.
2009-12-24
Printed circuit board and electronic package using same
Grant 6,985,362 - Mori , et al. January 10, 2
2006-01-10
Hole Drilling Method And Apparatus
App 20040164060 - Maeda, Yoji ;   et al.
2004-08-26
Ball grid array module and method of manufacturing same
Grant 6,667,559 - Tsukada , et al. December 23, 2
2003-12-23
Ball grid array module and method of manufacturing same
App 20020187585 - Tsukada, Yutaka ;   et al.
2002-12-12
Method for making a printed circuit board
Grant 6,378,201 - Tsukada , et al. April 30, 2
2002-04-30
Printed circuit board, method of making same, and photomask for use in the method
App 20020034619 - Yamada, Shinji ;   et al.
2002-03-21
Printed circuit board and electronic package using same
App 20020007964 - Mori, Hiroyuki ;   et al.
2002-01-24
Solder bump forming method and apparatus
App 20010010324 - Maeda, Yohji ;   et al.
2001-08-02
Multilayer printed wiring board and method of making same
Grant 5,956,843 - Mizumoto , et al. September 28, 1
1999-09-28
Electrical connection substrate having a through hole for connecting a chip to an opposite surface of the substrate
Grant 5,883,335 - Mizumoto , et al. March 16, 1
1999-03-16
Multilayer printed wiring board and method of making same
Grant 5,662,987 - Mizumoto , et al. September 2, 1
1997-09-02
Interconnect structure with replaced semiconductor chips
Grant 5,488,200 - Tsukada January 30, 1
1996-01-30
Multilayer printed circuit board and method for fabricating same
Grant 5,451,721 - Tsukada , et al. September 19, 1
1995-09-19
Method for replacing semiconductor chips
Grant 5,355,580 - Tsukada October 18, 1
1994-10-18
Conjugate having cytotoxicity and process for the preparation thereof
Grant 4,543,211 - Kato , et al. September 24, 1
1985-09-24

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