loadpatents
name:-0.039817810058594
name:-0.049017906188965
name:-0.00087594985961914
TSUKADA; Kiyotaka Patent Filings

TSUKADA; Kiyotaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for TSUKADA; Kiyotaka.The latest application filed is for "antiviral substrate, antiviral composition, method for manufacturing antiviral substrate, antimicrobial substrate, antimicrobial".

Company Profile
0.44.31
  • TSUKADA; Kiyotaka - Ibi-gun JP
  • Tsukada; Kiyotaka - Ogaki N/A JP
  • Tsukada; Kiyotaka - Gifu N/A JP
  • Tsukada; Kiyotaka - Ogaki-shi JP
  • Tsukada; Kiyotaka - Nagoya JP
  • Tsukada; Kiyotaka - Ogakishi JP
  • Tsukada; Kiyotaka - Ohgaki JP
  • Tsukada; Kiyotaka - Oogaki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Antiviral Substrate, Antiviral Composition, Method For Manufacturing Antiviral Substrate, Antimicrobial Substrate, Antimicrobial
App 20200236946 - HORINO; Katsutoshi ;   et al.		2020-07-30
Light-emitting element mounting substrate and method for manufacturing light-emitting element mounting substrate
Grant 10,319,892 - Hirasawa , et al.		2019-06-11
Light-emitting Element Mounting Substrate And Method For Manufacturing Light-emitting Element Mounting Substrate
App 20180233644 - Hirasawa; Takahisa ;   et al.		2018-08-16
Composite Wiring Board And Method For Manufacturing Composite Wiring Board
App 20170374742 - HIRASAWA; Takahisa ;   et al.		2017-12-28
Substrate for mounting electronic component and method for manufacturing the same
Grant 9,781,840 - Nagaya , et al. October 3, 2		2017-10-03
Light-emitting Element Mounting Substrate And Method For Manufacturing Light-emitting Element Mounting Substrate
App 20170222112 - HIRASAWA; Takahisa ;   et al.		2017-08-03
Flexible Printed Wiring Board, Electronic Device Having Flexible Printed Wiring Board, And Method For Manufacturing Electronic Device Having Flexible Printed Wiring Board
App 20170223816 - HIRASAWA; Takahisa ;   et al.		2017-08-03
Substrate For Mounting Electronic Component And Method For Manufacturing The Same
App 20160135302 - NAGAYA; Naoyuki ;   et al.		2016-05-12
Printed wiring board with reinforced insulation layer and manufacturing method thereof
Grant 8,710,374 - Tsukada , et al. April 29, 2		2014-04-29
Circuit board and semiconductor module
Grant 8,441,806 - Tsukada , et al. May 14, 2		2013-05-14
Semiconductor device and fabrication method therefor
Grant 8,415,791 - Tsukada , et al. April 9, 2		2013-04-09
Semiconductor device and method for manufacturing the same
Grant 8,378,231 - Tsukada , et al. February 19, 2		2013-02-19
Printed wiring board with resin complex layer and manufacturing method thereof
Grant 8,327,533 - Tsukada , et al. December 11, 2		2012-12-11
Semiconductor device and production method thereof
Grant 8,278,753 - Tsukada , et al. October 2, 2		2012-10-02
Multilayered Printed Circuit Board And Manufacturing Method Thereof
App 20120125680 - Hirose; Naohiro ;   et al.		2012-05-24
Method for manufacturing printed wiring board
Grant 8,156,646 - Iwai , et al. April 17, 2		2012-04-17
Multilayered printed circuit board and manufacturing method thereof
Grant 8,148,643 - Hirose , et al. April 3, 2		2012-04-03
Semiconductor Device And Fabrication Method Therefor
App 20110121450 - Tsukada; Kiyotaka ;   et al.		2011-05-26
Semiconductor Device And Production Method Thereof
App 20110121448 - TSUKADA; Kiyotaka ;   et al.		2011-05-26
Printed wiring board and method for manufacturing printed wiring board
Grant 7,943,861 - Iwai , et al. May 17, 2		2011-05-17
Circuit Board And Semiconductor Module
App 20110080714 - Tsukada; Kiyotaka ;   et al.		2011-04-07
Method of manufacturing a multilayered printed circuit board
Grant 7,832,098 - Hirose , et al. November 16, 2		2010-11-16
Flexible printed wiring board
Grant 7,786,389 - Tsukada , et al. August 31, 2		2010-08-31
Method of manufacturing printed wiring board
Grant 7,765,692 - Takada , et al. August 3, 2		2010-08-03
Semiconductor Device And Method For Manufacturing The Same
App 20100027228 - TSUKADA; Kiyotaka ;   et al.		2010-02-04
Printed Wiring Board And Method For Manufacturing Printed Wiring Board
App 20090285980 - IWAI; Tsutomu ;   et al.		2009-11-19
Printed wiring board and method for manufacturing the same
Grant 7,612,295 - Takada , et al. November 3, 2		2009-11-03
Method of manufacturing printed wiring board
Grant 7,594,320 - Takada , et al. September 29, 2		2009-09-29
Printed Wiring Board With Resin Complex Layer And Manufacturing Method Thereof
App 20090236128 - Tsukada; Kiyotaka ;   et al.		2009-09-24
Printed Wiring Board With Reinforced Insulation Layer And Manufacturing Method Thereof
App 20090229868 - TSUKADA; KIYOTAKA ;   et al.		2009-09-17
Printed wiring board having a solder pad and a method for manufacturing the same
Grant 7,568,922 - Yamashita , et al. August 4, 2		2009-08-04
Method of manufacturing a printed wiring board having a previously formed opening hole in an innerlayer conductor circuit
Grant 7,552,531 - Takada , et al. June 30, 2		2009-06-30
Printed Wiring Board And Method Of Manufacturing The Same
App 20090019693 - Takada; Masaru ;   et al.		2009-01-22
Printed wiring board
Grant 7,453,702 - Tsukada , et al. November 18, 2		2008-11-18
Printed Wiring Board and Method for Manufacturing Printed Wiring Board
App 20080264681 - Iwai; Tsutomu ;   et al.		2008-10-30
Method of manufacturing multilayered circuit board
Grant 7,415,761 - Hirose , et al. August 26, 2		2008-08-26
Multilayered Printed Circuit Board And Manufacturing Method Thereof
App 20080189943 - HIROSE; Naohiro ;   et al.		2008-08-14
Multilayered Printed Circuit Board And Manufacturing Method Thereof
App 20080173473 - HIROSE; Naohiro ;   et al.		2008-07-24
Flexible Printed Wiring Board
App 20080115963 - TSUKADA; Kiyotaka ;   et al.		2008-05-22
Printed wiring board and method for manufacturing the same
Grant 7,339,118 - Takada , et al. March 4, 2		2008-03-04
Flexible printed wiring board
Grant 7,312,401 - Tsukada , et al. December 25, 2		2007-12-25
Thin-film embedded capacitance, method for manufacturing thereof, and a printed wiring board
Grant 7,310,238 - Tsukada December 18, 2		2007-12-18
Thin-film embedded capacitance, method for manufacturing thereof, and a printed wiring board
App 20070030627 - Tsukada; Kiyotaka		2007-02-08
Printed Wiring Board and Method for Manufacturing The Same
App 20060202344 - Takada; Masaru ;   et al.		2006-09-14
Printed wiring board
App 20060169484 - Yamashita; Takahiro ;   et al.		2006-08-03
Flexible printed wiring board
App 20060068613 - Tsukada; Kiyotaka ;   et al.		2006-03-30
Printed wiring board
App 20060049509 - Tsukada; Kiyotaka ;   et al.		2006-03-09
Printed wiring board and method of manufacturing the same
App 20060042824 - Takada; Masaru ;   et al.		2006-03-02
Printed wiring board and method of manufacturing the same
Grant 6,986,917 - Takada , et al. January 17, 2		2006-01-17
Printed-circuit board and method of manufacture thereof
Grant 6,809,415 - Tsukada , et al. October 26, 2		2004-10-26
Printed wiring board and method for producing the same
Grant 6,715,204 - Tsukada , et al. April 6, 2		2004-04-06
Multilayered printed circuit board and manufacturing method therefor
App 20040025333 - Hirose, Naohiro ;   et al.		2004-02-12
Printed wiring board and method of manufacturing the same
App 20030203170 - Takada, Masaru ;   et al.		2003-10-30
Printed wiring board and method of manufacturing the same
App 20030150644 - Takada, Masaru ;   et al.		2003-08-14
Manufacturing method of a multilayered printed circuit board having an opening made by a laser, and using electroless and electrolytic plating
Grant 6,591,495 - Hirose , et al. July 15, 2		2003-07-15
Printed wiring board having throughole and annular lands
Grant 6,590,165 - Takada , et al. July 8, 2		2003-07-08
Printed wiring board and method of manufacturing the same
Grant 6,555,208 - Takada , et al. April 29, 2		2003-04-29
Multilayer printed wiring board and method for manufacturing the same
Grant 6,455,783 - Tsukada , et al. September 24, 2		2002-09-24
Multilayered printed circuit board and manufacturing method therefor
App 20010042637 - Hirose, Naohiro ;   et al.		2001-11-22
Printed wiring board and method of manufacturing the same
App 20010038905 - Takada, Masaru ;   et al.		2001-11-08
Printed wiring board and method of manufacturing the same
Grant 6,284,353 - Takada , et al. September 4, 2		2001-09-04
Printed-circuit board and method of manufacture thereof
App 20010002728 - Tsukada, Kiyotaka ;   et al.		2001-06-07
Electronic component mounting base board having heat slug with slits and projections
Grant 6,232,558 - Tsukada , et al. May 15, 2		2001-05-15
Printed wiring board and method for manufacturing the same
Grant 6,228,466 - Tsukada , et al. May 8, 2		2001-05-08
Electronic component mounting base board and method of producing the same
Grant 5,914,859 - Takada , et al. June 22, 1		1999-06-22
Electronic circuit substrate
Grant 5,144,536 - Tsukada , et al. September 1, 1		1992-09-01
Unique ceramic compound
Grant 5,114,886 - Tsukada May 19, 1		1992-05-19
Thermal storage unit
Grant 4,993,481 - Kamimoto , et al. February 19, 1		1991-02-19
Valve provided with valve bodies made of a ceramic compound
Grant 4,932,438 - Kitamura , et al. June 12, 1		1990-06-12
Porous silicon carbide sinter and its production
Grant 4,777,152 - Tsukada October 11, 1		1988-10-11
Powder composition for producing sintered ceramic
Grant 4,485,182 - Enomoto , et al. November 27, 1		1984-11-27

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