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Patent applications and USPTO patent grants for Tsujino; Fumio.The latest application filed is for "abrasive composition for polishing semiconductor device and method for producing semiconductor device using the same".
Patent | Date |
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Abrasive composition for polishing semiconductor device and method for producing semiconductor device using the same Grant 6,733,553 - Kido , et al. May 11, 2 | 2004-05-11 |
Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry Grant 6,478,836 - Kido , et al. November 12, 2 | 2002-11-12 |
Abrasive composition for polishing semiconductor device and method for producing semiconductor device using the same App 20020059755 - Kido, Takanori ;   et al. | 2002-05-23 |
Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry Grant 6,387,139 - Kido , et al. May 14, 2 | 2002-05-14 |
Cerium oxide slurry for polishing, process for preparing the slurry, and process for polishing with the slurry App 20020032989 - Kido, Takanori ;   et al. | 2002-03-21 |
Polishing material composition and polishing method for polishing LSI devices Grant 6,299,659 - Kido , et al. October 9, 2 | 2001-10-09 |
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