loadpatents
Patent applications and USPTO patent grants for Tsujikawa; Toshihiko.The latest application filed is for "component mounter and mounting board manufacturing method".
Patent | Date |
---|---|
Component mounter and mounting board manufacturing method Grant 10,813,227 - Tsujikawa , et al. October 20, 2 | 2020-10-20 |
Bonding apparatus Grant 10,058,019 - Tsuboi , et al. August 21, 2 | 2018-08-21 |
Component Mounter And Mounting Board Manufacturing Method App 20180132359 - TSUJIKAWA; Toshihiko ;   et al. | 2018-05-10 |
Component crimping apparatus Grant 9,872,395 - Yamada , et al. January 16, 2 | 2018-01-16 |
Component mounting apparatus Grant 9,842,824 - Yamada , et al. December 12, 2 | 2017-12-12 |
Component crimping apparatus Grant 9,739,300 - Yamada , et al. August 22, 2 | 2017-08-22 |
Component mounting apparatus Grant 9,703,129 - Yamada , et al. July 11, 2 | 2017-07-11 |
Component mounting apparatus Grant 9,673,165 - Okada , et al. June 6, 2 | 2017-06-06 |
Component mounting apparatus Grant 9,547,190 - Okada , et al. January 17, 2 | 2017-01-17 |
Component Mounting Apparatus App 20160143154 - YAMADA; Akira ;   et al. | 2016-05-19 |
Component Crimping Apparatus App 20160052196 - YAMADA; Akira ;   et al. | 2016-02-25 |
Component Crimping Apparatus App 20160052197 - YAMADA; Akira ;   et al. | 2016-02-25 |
Component mounting apparatus, illuminating apparatus used in imaging and illuminating method Grant 9,036,022 - Tsuboi , et al. May 19, 2 | 2015-05-19 |
Bonding Apparatus App 20150096687 - Tsuboi; Yasutaka ;   et al. | 2015-04-09 |
Component Mounting Apparatus App 20150083335 - OKADA; Yasuhiro ;   et al. | 2015-03-26 |
Component Mounting Apparatus App 20150082621 - YAMADA; Akira ;   et al. | 2015-03-26 |
Component Mounting Apparatus App 20150083336 - OKADA; Yasuhiro ;   et al. | 2015-03-26 |
Inspection apparatus and inspection method Grant 8,300,921 - Iwahashi , et al. October 30, 2 | 2012-10-30 |
Component Mounting Apparatus, Illuminating Apparatus Used In Imaging And Illuminating Method App 20120262567 - Tsuboi; Yasutaka ;   et al. | 2012-10-18 |
Component Mounting Apparatus, Illuminating Apparatus Used In Imaging And Illuminating Method App 20120257043 - Tsuboi; Yasutaka ;   et al. | 2012-10-11 |
Inspection apparatus and inspection method Grant 8,285,028 - Iwahashi , et al. October 9, 2 | 2012-10-09 |
Bonding sheet applying apparatus and method Grant 7,850,800 - Ueno , et al. December 14, 2 | 2010-12-14 |
Inspection Apparatus And Inspection Method App 20100296721 - Iwahashi; Takashi ;   et al. | 2010-11-25 |
Inspection Apparatus And Inspection Method App 20100220918 - Iwahashi; Takashi ;   et al. | 2010-09-02 |
Component bonding method and component bonding device Grant 7,708,848 - Tsujikawa , et al. May 4, 2 | 2010-05-04 |
Bonding Sheet Applying Apparatus And Method App 20090065120 - Ueno; Tetsuro ;   et al. | 2009-03-12 |
Component Bonding Method and Component Bonding Device App 20090011676 - Tsujikawa; Toshihiko ;   et al. | 2009-01-08 |
Method and apparatus for automatic registration for a board Grant 6,707,289 - Yamauchi , et al. March 16, 2 | 2004-03-16 |
Method and apparatus for automatic registration for a board App 20030080727 - Yamauchi, Satoshi ;   et al. | 2003-05-01 |
Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component Grant 6,167,149 - Tsujikawa , et al. December 26, 2 | 2000-12-26 |
System for inspecting an appearance of a printed circuit board Grant 6,081,613 - Ikurumi , et al. June 27, 2 | 2000-06-27 |
Inspecting apparatus of mounted component Grant 5,724,439 - Mizuoka , et al. March 3, 1 | 1998-03-03 |
Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component Grant 5,555,316 - Tsujikawa , et al. September 10, 1 | 1996-09-10 |
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