loadpatents
name:-0.01057505607605
name:-0.014709949493408
name:-0.0015568733215332
Tsujikawa; Toshihiko Patent Filings

Tsujikawa; Toshihiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsujikawa; Toshihiko.The latest application filed is for "component mounter and mounting board manufacturing method".

Company Profile
1.19.15
  • Tsujikawa; Toshihiko - Osaka JP
  • Tsujikawa; Toshihiko - Yamanashi JP
  • Tsujikawa; Toshihiko - Osaka-fu JP
  • Tsujikawa; Toshihiko - Sakai JP
  • Tsujikawa; Toshihiko - Toyonaka JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Component mounter and mounting board manufacturing method
Grant 10,813,227 - Tsujikawa , et al. October 20, 2
2020-10-20
Bonding apparatus
Grant 10,058,019 - Tsuboi , et al. August 21, 2
2018-08-21
Component Mounter And Mounting Board Manufacturing Method
App 20180132359 - TSUJIKAWA; Toshihiko ;   et al.
2018-05-10
Component crimping apparatus
Grant 9,872,395 - Yamada , et al. January 16, 2
2018-01-16
Component mounting apparatus
Grant 9,842,824 - Yamada , et al. December 12, 2
2017-12-12
Component crimping apparatus
Grant 9,739,300 - Yamada , et al. August 22, 2
2017-08-22
Component mounting apparatus
Grant 9,703,129 - Yamada , et al. July 11, 2
2017-07-11
Component mounting apparatus
Grant 9,673,165 - Okada , et al. June 6, 2
2017-06-06
Component mounting apparatus
Grant 9,547,190 - Okada , et al. January 17, 2
2017-01-17
Component Mounting Apparatus
App 20160143154 - YAMADA; Akira ;   et al.
2016-05-19
Component Crimping Apparatus
App 20160052196 - YAMADA; Akira ;   et al.
2016-02-25
Component Crimping Apparatus
App 20160052197 - YAMADA; Akira ;   et al.
2016-02-25
Component mounting apparatus, illuminating apparatus used in imaging and illuminating method
Grant 9,036,022 - Tsuboi , et al. May 19, 2
2015-05-19
Bonding Apparatus
App 20150096687 - Tsuboi; Yasutaka ;   et al.
2015-04-09
Component Mounting Apparatus
App 20150083335 - OKADA; Yasuhiro ;   et al.
2015-03-26
Component Mounting Apparatus
App 20150082621 - YAMADA; Akira ;   et al.
2015-03-26
Component Mounting Apparatus
App 20150083336 - OKADA; Yasuhiro ;   et al.
2015-03-26
Inspection apparatus and inspection method
Grant 8,300,921 - Iwahashi , et al. October 30, 2
2012-10-30
Component Mounting Apparatus, Illuminating Apparatus Used In Imaging And Illuminating Method
App 20120262567 - Tsuboi; Yasutaka ;   et al.
2012-10-18
Component Mounting Apparatus, Illuminating Apparatus Used In Imaging And Illuminating Method
App 20120257043 - Tsuboi; Yasutaka ;   et al.
2012-10-11
Inspection apparatus and inspection method
Grant 8,285,028 - Iwahashi , et al. October 9, 2
2012-10-09
Bonding sheet applying apparatus and method
Grant 7,850,800 - Ueno , et al. December 14, 2
2010-12-14
Inspection Apparatus And Inspection Method
App 20100296721 - Iwahashi; Takashi ;   et al.
2010-11-25
Inspection Apparatus And Inspection Method
App 20100220918 - Iwahashi; Takashi ;   et al.
2010-09-02
Component bonding method and component bonding device
Grant 7,708,848 - Tsujikawa , et al. May 4, 2
2010-05-04
Bonding Sheet Applying Apparatus And Method
App 20090065120 - Ueno; Tetsuro ;   et al.
2009-03-12
Component Bonding Method and Component Bonding Device
App 20090011676 - Tsujikawa; Toshihiko ;   et al.
2009-01-08
Method and apparatus for automatic registration for a board
Grant 6,707,289 - Yamauchi , et al. March 16, 2
2004-03-16
Method and apparatus for automatic registration for a board
App 20030080727 - Yamauchi, Satoshi ;   et al.
2003-05-01
Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component
Grant 6,167,149 - Tsujikawa , et al. December 26, 2
2000-12-26
System for inspecting an appearance of a printed circuit board
Grant 6,081,613 - Ikurumi , et al. June 27, 2
2000-06-27
Inspecting apparatus of mounted component
Grant 5,724,439 - Mizuoka , et al. March 3, 1
1998-03-03
Inspecting apparatus of mounting state of component or printing state of cream solder in mounting line of electronic component
Grant 5,555,316 - Tsujikawa , et al. September 10, 1
1996-09-10

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