Tsuji; Shinjiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsuji; Shinjiro.The latest application filed is for "component mounting line and component mounting method".

Company Profile

0.15.14

Tsuji; Shinjiro - Yamanashi JP
Tsuji; Shinjiro - Nara JP
Tsuji; Shinjiro - Kadoma-shi JP
Tsuji, Shinjiro - Nara-shi JP
Tsuji; Shinjiro - Sakai JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Component bonding device Grant 10,479,061 - Kameda , et al. Nov	2019-11-19
Component crimping apparatus Grant 10,065,275 - Kameda , et al. September 4, 2	2018-09-04
Component mounting line and component mounting method Grant 9,983,421 - Adachi , et al. May 29, 2	2018-05-29
Component crimping apparatus Grant 9,872,395 - Yamada , et al. January 16, 2	2018-01-16
Component crimping apparatus Grant 9,739,300 - Yamada , et al. August 22, 2	2017-08-22
Component Mounting Line And Component Mounting Method App 20160286664 - ADACHI; Satoshi ; et al.	2016-09-29
Component Crimping Apparatus App 20160113164 - KAMEDA; Akira ; et al.	2016-04-21
Component Crimping Apparatus App 20160052196 - YAMADA; Akira ; et al.	2016-02-25
Component Crimping Apparatus App 20160052197 - YAMADA; Akira ; et al.	2016-02-25
Component Bonding Device App 20150367618 - KAMEDA; Akira ; et al.	2015-12-24
Tape splicing apparatus and attaching apparatus Grant 8,062,450 - Odawara , et al. November 22, 2	2011-11-22
Substrate edge part cleaning apparatus and substrate edge part cleaning method Grant 7,803,231 - Katano , et al. September 28, 2	2010-09-28
Apparatus and method for cleaning a board terminal Grant 7,799,142 - Watanabe , et al. September 21, 2	2010-09-21
Method for transferring a substrate Grant 7,716,818 - Tsuji , et al. May 18, 2	2010-05-18
Substrate processing apparatus and mounter Grant 7,653,989 - Murata , et al. February 2, 2	2010-02-02
Tape Splicing Apparatus And Attaching Apparatus App 20090288777 - Odawara; Kozo ; et al.	2009-11-26
Apparatus and Method for Cleaning a Board Terminal App 20090065029 - Watanabe; Masaya ; et al.	2009-03-12
Substrate Processing Apparatus and Mounter App 20080301932 - Murata; Takahiko ; et al.	2008-12-11
Substrate Transfer Apparatus, Component Mounting Equipment, and Substrate Transfer Method App 20080193262 - Tsuji; Shinjiro ; et al.	2008-08-14
Adhesive sheet stamping device, adhesive sheet stamping method Grant 7,285,175 - Nishimoto , et al. October 23, 2	2007-10-23
Substrate edge part cleaning apparatus and substrate edge part cleaning method App 20070181152 - Katano; Ryouichirou ; et al.	2007-08-09
Electronic component, component mounting equipment, and component mounting method Grant 7,220,922 - Nishino , et al. May 22, 2	2007-05-22
Component mounting apparatus and component mounting method, and recognition apparatus for a component mount panel, component mounting apparatus for a liquid crystal panel, and component mounting method for a liquid crystal panel Grant 7,089,073 - Tsuji , et al. August 8, 2	2006-08-08
Component mounting apparatus and component mounting method Grant 7,021,357 - Katano , et al. April 4, 2	2006-04-04
Adhesive sheet stamping device, adhesive sheet stamping method, part mounter display panel manufacturing method App 20050260341 - Nishimoto, Tomotaka ; et al.	2005-11-24
Electronic component component mounting equipment and component mounting method App 20040060666 - Nishino, Kenichi ; et al.	2004-04-01
Component mounting apparatus and component mounting method App 20030070280 - Katano, Ryoichiro ; et al.	2003-04-17
Component mounting apparatus and component mounting method, and recognition apparatus for component mount panel, component mounting apparatus for liquid crystal panel, and component mounting method for liquid crystal panel App 20030033034 - Tsuji, Shinjiro ; et al.	2003-02-13
Method of film-coating hard capsules Grant 4,670,287 - Tsuji June 2, 1	1987-06-02

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