Tsui; Ting Y.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsui; Ting Y..The latest application filed is for "systems and methods that selectively modify liner induced stress".

Company Profile

0.9.10

Tsui; Ting Y. - Markham CA
Tsui; Ting Y. - Garland TX
Tsui; Ting Y. - US
Tsui; Ting Y. - Palo Alto CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Formation of a silicon oxide interface layer during silicon carbide etch stop deposition to promote better dielectric stack adhesion Grant 7,682,989 - Matz , et al. March 23, 2	2010-03-23
Energy beam treatment to improve packaging reliability Grant 7,678,713 - Tsui , et al. March 16, 2	2010-03-16
Systems And Methods That Selectively Modify Liner Induced Stress App 20090017588 - Tsui; Ting Y. ; et al.	2009-01-15
Formation Of A Silicon Oxide Interface Layer During Silicon Carbide Etch Stop Deposition To Promote Better Dielectric Stack Adhesion App 20080283975 - Matz; Laura M. ; et al.	2008-11-20
Systems and methods that selectively modify liner induced stress Grant 7,442,597 - Tsui , et al. October 28, 2	2008-10-28
Methods to facilitate etch uniformity and selectivity Grant 7,341,941 - Tsui , et al. March 11, 2	2008-03-11
Semiconductor device fabricated using a carbon-containing film as a contact etch stop layer App 20070210421 - Bu; Haowen ; et al.	2007-09-13
Post-polish treatment for inhibiting copper corrosion Grant 7,268,073 - Ramappa , et al. September 11, 2	2007-09-11
Method of fabricating a microelectronic device using electron beam treatment to induce stress App 20070105368 - Tsui; Ting Y. ; et al.	2007-05-10
Methods to facilitate etch uniformity and selectivity App 20070042599 - Tsui; Ting Y. ; et al.	2007-02-22
Energy beam treatment to improve packaging reliability App 20070032094 - Tsui; Ting Y. ; et al.	2007-02-08
Energy beam treatment to improve the hermeticity of a hermetic layer App 20060264028 - Matz; Laura M. ; et al.	2006-11-23
Interconnect structure including a silicon oxycarbonitride layer App 20060264042 - Matz; Laura M. ; et al.	2006-11-23
Systems and methods that selectively modify liner induced stress App 20060172481 - Tsui; Ting Y. ; et al.	2006-08-03
Post-polish treatment for inhibiting copper corrosion App 20060099804 - Ramappa; Deepak A. ; et al.	2006-05-11
Adhesion strength testing using a depth-sensing indentation technique Grant 6,339,958 - Tsui , et al. January 22, 2	2002-01-22
Using polysilicon fuse for IC programming Grant 6,242,790 - Tsui , et al. June 5, 2	2001-06-05
Semiconductor device having a low dielectric constant material Grant 6,208,030 - Tsui , et al. March 27, 2	2001-03-27
Method for measuring fracture toughness of thin films Grant 6,053,034 - Tsui , et al. April 25, 2	2000-04-25

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