TSUI; Ching Man
Patent Applications and Registrations
Patent applications and USPTO patent grants for TSUI; Ching Man.The latest application filed is for "plated lead frame including doped silver layer".
- TSUI; Ching Man - Kwai Chung HK
- Tsui; Ching Man - Hong Kong CN
| Patent | Date |
|---|---|
| Plated Lead Frame Including Doped Silver Layer App 20170365759 - LAM; Yu Lung ; et al. | 2017-12-21 |
| Plated lead frame including doped silver layer Grant 9,847,468 - Lam , et al. December 19, 2 | 2017-12-19 |
| Pre-plated Lead Frame For Copper Wire Bonding App 20130098659 - KWAN; Yiu Fai ; et al. | 2013-04-25 |
| Apparatus for supporting semiconductor devices during testing Grant 7,486,092 - Tsui , et al. February 3, 2 | 2009-02-03 |
| Apparatus and method for testing semiconductor devices App 20040195665 - Tsui, Ching Man ; et al. | 2004-10-07 |
| Apparatus and method for testing semiconductor devices Grant 6,783,316 - Tsui , et al. August 31, 2 | 2004-08-31 |
| Apparatus and method for testing semiconductor devices App 20020196043 - Tsui, Ching Man ; et al. | 2002-12-26 |
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