Tsui; Anthony C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsui; Anthony C..The latest application filed is for "semiconductor package featuring flip-chip die sandwiched between metal layers".

Company Profile

0.10.16

Tsui; Anthony C. - Saratoga CA US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bi-directional, reverse blocking battery switch Grant 8,558,368 - Harnden , et al. October 15, 2	2013-10-15
Semiconductor Package Featuring Flip-chip Die Sandwiched Between Metal Layers App 20130105974 - Tsui; Anthony C.	2013-05-02
Semiconductor package featuring flip-chip die sandwiched between metal layers Grant 8,358,017 - Tsui January 22, 2	2013-01-22
Method Of Manufacturing A Semiconductor Device Package With A Heatsink App 20130017652 - Tsui; Anthony C. ; et al.	2013-01-17
Semiconductor Device Package Having Features Formed By Stamping App 20130009296 - Tsui; Anthony C. ; et al.	2013-01-10
Semiconductor Device Package Having Configurable Lead Frame Fingers App 20130009297 - Tsui; Anthony C. ; et al.	2013-01-10
Power Semiconductor Device Packaging App 20120181676 - Tsui; Anthony C. ; et al.	2012-07-19
Semiconductor Device Package With Two Component Lead Frame App 20120181677 - Tsui; Anthony C. ; et al.	2012-07-19
Bi-directional, Reverse Blocking Battery Switch App 20120056261 - Harnden; James ; et al.	2012-03-08
Interconnection of lead frame to die utilizing flip chip process Grant 8,120,154 - Eslamy , et al. February 21, 2	2012-02-21
Semiconductor device package having features formed by stamping Grant 8,106,493 - Tsui , et al. January 31, 2	2012-01-31
Bi-directional, reverse blocking battery switch Grant 8,097,945 - Harnden , et al. January 17, 2	2012-01-17
Semiconductor Device Package Featuring Encapsulated Leadframe With Projecting Bumps Or Balls App 20110291254 - Harnden; James ; et al.	2011-12-01
Semiconductor Device Package Having Features Formed By Stamping App 20110024886 - Tsui; Anthony C. ; et al.	2011-02-03
Semiconductor device package having features formed by stamping Grant 7,838,339 - Tsui , et al. November 23, 2	2010-11-23
Interconnection Of Lead Frame To Die Utilizing Flip Chip Process App 20100140762 - Eslamy; Mohammad ; et al.	2010-06-10
Interconnection of lead frame to die utilizing flip chip process Grant 7,691,670 - Eslamy , et al. April 6, 2	2010-04-06
Semiconductor Package Featuring Flip-chip Die Sandwiched Between Metal Layers App 20090283919 - Tsui; Anthony C. ; et al.	2009-11-19
Interconnection Of Lead Frame To Die Utilizing Flip Chip Process App 20090273065 - Eslamy; Mohammad ; et al.	2009-11-05
Semiconductor Device Package Having Features Formed By Stamping App 20090250796 - Tsui; Anthony C. ; et al.	2009-10-08
Bi-directional, Reverse Blocking Battery Switch App 20090179265 - Harnden; James ; et al.	2009-07-16
Semiconductor Device Package Featuring Encapsulated Leadframe With Projecting Bumps Or Balls App 20080135991 - Harnden; James ; et al.	2008-06-12
Separate circuit devices in an intra-package configuration and assembly techniques Grant 6,066,890 - Tsui , et al. May 23, 2	2000-05-23

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