Tsugawa; Yuta
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tsugawa; Yuta.The latest application filed is for "silicon nitride substrate, silicon nitride-metal composite, silicon nitride circuit board, and semiconductor package".
- Tsugawa; Yuta - Omuta JP
- TSUGAWA; Yuta - Tokyo JP
- TSUGAWA; Yuta - Omuta-shi JP
| Patent | Date |
|---|---|
| Ceramic circuit substrate Grant 11,430,727 - Aono , et al. August 30, 2 | 2022-08-30 |
| Silicon Nitride Substrate, Silicon Nitride-metal Composite, Silicon Nitride Circuit Board, And Semiconductor Package App 20220177377 - TSUGAWA; Yuta ; et al. | 2022-06-09 |
| Bonded Substrate, Metal Circuit Board, And Circuit Board App 20220039264 - TSUGAWA; Yuta ; et al. | 2022-02-03 |
| Ceramic Circuit Board And Module Using Same App 20210176860 - TSUGAWA; Yuta ; et al. | 2021-06-10 |
| Ceramic Circuit Substrate App 20200185320 - AONO; Ryota ; et al. | 2020-06-11 |
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