Tsubomatsu; Yoshiaki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsubomatsu; Yoshiaki.The latest application filed is for "optical waveguide, optical waveguide manufacturing method, and optical module".

Company Profile

0.12.6

Tsubomatsu; Yoshiaki - Ibaraki JP
Tsubomatsu; Yoshiaki - Chikusei N/A JP
Tsubomatsu; Yoshiaki - Chikusei-shi JP
Tsubomatsu; Yoshiaki - Tsuchiura JP
Tsubomatsu, Yoshiaki - Tsuchiura-shi JP
Tsubomatsu; Yoshiaki - Shimodate JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Optical Waveguide, Optical Waveguide Manufacturing Method, And Optical Module App 20160252675 - Sakai; Daichi ; et al.	2016-09-01
Substrate for mounting semiconductor chip and method for producing same Grant 8,997,341 - Ejiri , et al. April 7, 2	2015-04-07
Substrate For Mounting Semiconductor Chip And Method For Producing Same App 20120234584 - Ejiri; Yoshinori ; et al.	2012-09-20
Fabrication process of semiconductor package and semiconductor package Grant 7,187,072 - Fukutomi , et al. March 6, 2	2007-03-06
Fabrication process of semiconductor package and semiconductor package App 20040110319 - Fukutomi, Naoki ; et al.	2004-06-10
Fabrication process of semiconductor package and semiconductor package Grant 6,746,897 - Fukutomi , et al. June 8, 2	2004-06-08
Process for the fabrication of wiring board for electrical tests Grant 6,568,073 - Fukutomi , et al. May 27, 2	2003-05-27
Fabrication process of semiconductor package and semiconductor package App 20020094606 - Fukutomi, Naoki ; et al.	2002-07-18
Fabrication process of semiconductor package and semiconductor package App 20020039808 - Fukutomi, Naoki ; et al.	2002-04-04
Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package Grant 6,236,108 - Sota , et al. May 22, 2	2001-05-22
Method of production of semiconductor device Grant 6,223,429 - Kaneda , et al. May 1, 2	2001-05-01
Substrate for holding a chip of semi-conductor package, semi-conductor package, and fabrication process of semi-conductor package Grant 6,064,111 - Sota , et al. May 16, 2	2000-05-16
Fabrication process of semiconductor package and semiconductor package Grant 5,976,912 - Fukutomi , et al. November 2, 1	1999-11-02
Fabrication process of wiring board Grant 5,504,992 - Fukutomi , et al. April 9, 1	1996-04-09
Fabrication process of wiring board Grant 5,426,850 - Fukutomi , et al. June 27, 1	1995-06-27
Process for producing high-density wiring board Grant 4,830,691 - Kida , et al. May 16, 1	1989-05-16

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