Tsuboi; Yasutaka

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsuboi; Yasutaka.The latest application filed is for "component crimping apparatus".

Company Profile

0.15.11

Tsuboi; Yasutaka - Yamanashi JP
Tsuboi; Yasutaka - Hirakata JP
Tsuboi; Yasutaka - Osaka JP
Tsuboi, Yasutaka - Hirakata-shi JP
Tsuboi, Yasutaka - Hirakata-shi Osaka JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Bonding apparatus Grant 10,058,019 - Tsuboi , et al. August 21, 2	2018-08-21
Component crimping apparatus Grant 9,872,395 - Yamada , et al. January 16, 2	2018-01-16
Component crimping apparatus Grant 9,739,300 - Yamada , et al. August 22, 2	2017-08-22
Component mounting apparatus Grant 9,703,129 - Yamada , et al. July 11, 2	2017-07-11
Component Crimping Apparatus App 20160052196 - YAMADA; Akira ; et al.	2016-02-25
Component Crimping Apparatus App 20160052197 - YAMADA; Akira ; et al.	2016-02-25
Component mounting apparatus, illuminating apparatus used in imaging and illuminating method Grant 9,036,022 - Tsuboi , et al. May 19, 2	2015-05-19
Bonding Apparatus App 20150096687 - Tsuboi; Yasutaka ; et al.	2015-04-09
Component Mounting Apparatus App 20150082621 - YAMADA; Akira ; et al.	2015-03-26
Component Mounting Apparatus, Illuminating Apparatus Used In Imaging And Illuminating Method App 20120262567 - Tsuboi; Yasutaka ; et al.	2012-10-18
Component Mounting Apparatus, Illuminating Apparatus Used In Imaging And Illuminating Method App 20120257043 - Tsuboi; Yasutaka ; et al.	2012-10-11
Bump formation method and bump forming apparatus for semiconductor wafer Grant 7,516,878 - Narita , et al. April 14, 2	2009-04-14
Bump formation method and bump forming apparatus for semiconductor wafer Grant 7,052,984 - Narita , et al. May 30, 2	2006-05-30
Bump formation method and bump forming apparatus for semiconductor wafer App 20060102701 - Narita; Shoriki ; et al.	2006-05-18
Method and apparatus for correcting inclination of IC on semiconductor wafer Grant 7,031,509 - Narita , et al. April 18, 2	2006-04-18
Component mounting apparatus and component mounting method Grant 7,021,357 - Katano , et al. April 4, 2	2006-04-04
Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate Grant 7,014,092 - Narita , et al. March 21, 2	2006-03-21
Bump Forming Apparatus For Charge Appearance Semiconductor Substrate, Charge Removal Method For Charge Appearance Semiconductor Substrate, Charge Removing Unit For Charge Appearance Semiconductor Substrate, And Charge Appearance Semiconductor Substrate Grant 7,005,368 - Narita , et al. February 28, 2	2006-02-28
Electric Charge Generating Semiconductor Substrate Bump Forming Device, Method Of Removing Electric Charge From Electric Charge Generating Semiconductor Substrate Device For Removing Electric Charge From Electric Charge Generating Semiconductor Substrate, And Electric Charge Generating Semiconductor Grant 6,818,975 - Narita , et al. November 16, 2	2004-11-16
Bump forming apparatus for charge appearance semiconductor substrate, charge removal method for charge appearance semiconductor substrate, charge removing unit for charge appearance semiconductor substrate, and charge appearance semiconductor substrate App 20040035849 - Narita, Shoriki ; et al.	2004-02-26
Bump formation method and bump forming apparatus to semiconductor wafer App 20040020973 - Narita, Shoriki ; et al.	2004-02-05
Component mounting apparatus and component mounting method App 20030070280 - Katano, Ryoichiro ; et al.	2003-04-17
Electronic component mounting apparatus Grant 6,542,238 - Tsuboi , et al. April 1, 2	2003-04-01
Method and apparatus for correcting inclination of IC on semiconductor wafer App 20020061129 - Narita, Shoriki ; et al.	2002-05-23
Component detection method Grant 5,825,914 - Tsuboi , et al. October 20, 1	1998-10-20

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