TSLC CORPORATION
Patent Applications and Registrations
Patent applications and USPTO patent grants for TSLC CORPORATION.The latest application filed is for "uv led package having encapsulating extraction layer".
- TSLC CORPORATION - Chu-Nan TW
- TSLC Corporation - Miao-Li County TW
- TSLC CORPORATION - Chu-nan 350 TW
- TSLC CORP. - Hsinchu TW
- TSLC CORPORATION - Hsinchu City TW
- TSLC Corporation - Hsinchu TW
| Patent | Date |
|---|---|
| UV LED Package Having Encapsulating Extraction Layer App 20220131056 - LIN; TZU-YING ; et al. | 2022-04-28 |
| Three-dimensional Optoelectronic Device Package And Method For Manufacturing The Same App 20210366903 - LEE; Po-Wei | 2021-11-25 |
| Uv Led Package App 20210111318 - LIN; TZU-YING ; et al. | 2021-04-15 |
| Semiconductor Components And Semiconductor Structures And Methods Of Fabrication App 20210066547 - Doan; Trung Tri ; et al. | 2021-03-04 |
| Light emitting device Grant 10,256,217 - Lee , et al. | 2019-04-09 |
| Light Emitting Device App 20180342486 - Lee; Po-Wei ; et al. | 2018-11-29 |
| Light emitting diode (LED) bulb and lighting system having high and low beams Grant 9,651,214 - Lee , et al. May 16, 2 | 2017-05-16 |
| Light Emitting Diode (led) Bulb And Lighting System Having High And Low Beams App 20160290585 - LEE; CHENG-SHIH ; et al. | 2016-10-06 |
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