TSENG; Ya-Wen
Patent Applications and Registrations
Patent applications and USPTO patent grants for TSENG; Ya-Wen.The latest application filed is for "integrated circuit filler and method thereof".
- TSENG; Ya-Wen - Hsinchu City TW
- Tseng; Ya-Wen - Hsinchu TW
- Tseng; Ya-Wen - Hsin-Chu N/A TW
| Patent | Date |
|---|---|
| Integrated Circuit Filler And Method Thereof App 20220246600 - LO; Tseng Chin ; et al. | 2022-08-04 |
| Integrated circuit filler and method thereof Grant 11,309,307 - Lo , et al. April 19, 2 | 2022-04-19 |
| Integrated Circuit Filler And Method Thereof App 20200303366 - LO; Tseng Chin ; et al. | 2020-09-24 |
| Integrated circuit filler and method thereof Grant 10,679,980 - Lo , et al. | 2020-06-09 |
| Integrated Circuit Filler And Method Thereof App 20190371783 - LO; Tseng Chin ; et al. | 2019-12-05 |
| Integrated circuit filler and method thereof Grant 10,388,645 - Lo , et al. A | 2019-08-20 |
| Integrated circuit filler and method thereof Grant 10,283,496 - Lo , et al. | 2019-05-07 |
| Integrated Circuit Filler And Method Thereof App 20180358348 - LO; Tseng Chin ; et al. | 2018-12-13 |
| Integrated Circuit Filler And Method Thereof App 20180006010 - LO; Tseng Chin ; et al. | 2018-01-04 |
| Barrier structures and methods for through substrate vias Grant 8,704,375 - Liu , et al. April 22, 2 | 2014-04-22 |
| Barrier Structures and Methods for Through Substrate Vias App 20100193954 - Liu; Max ; et al. | 2010-08-05 |
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