| Patent | Date |
|---|
Apparatus for wafer processing
Grant 11,315,810 - Tseng , et al. April 26, 2 | 2022-04-26 |
Apparatus For Wafer Processing
App 20200365428 - TSENG; TUNG-CHING ; et al. | 2020-11-19 |
Chemical Vapor Deposition Apparatus With Cleaning Gas Flow Guiding Member
App 20190136373 - YEH; Chih-Hung ; et al. | 2019-05-09 |
Method of manufacturing a semiconductor device
Grant 10,121,698 - Lee , et al. November 6, 2 | 2018-11-06 |
Semiconductor Manufacturing Equipment And Method For Treating Wafer
App 20170194162 - LIU; Hsin-Chih ; et al. | 2017-07-06 |
Semiconductor Device Metallization Systems and Methods
App 20170125290 - Lee; Hsiang-Huan ; et al. | 2017-05-04 |
Semiconductor device metallization systems and methods
Grant 9,548,241 - Lee , et al. January 17, 2 | 2017-01-17 |
Semiconductor Device Metallization Systems and Methods
App 20160181152 - Lee; Hsiang-Huan ; et al. | 2016-06-23 |
Semiconductor device metallization systems and methods
Grant 9,318,364 - Lee , et al. April 19, 2 | 2016-04-19 |
Semiconductor Device Metallization Systems and Methods
App 20150197849 - Lee; Hsiang-Huan ; et al. | 2015-07-16 |
Scratch reduction for chemical mechanical polishing
Grant 7,297,632 - Hou , et al. November 20, 2 | 2007-11-20 |
Scratch reduction for chemical mechanical polishing
App 20060211250 - Hou; Chuang-Ping ; et al. | 2006-09-21 |
Method for chemical mechanical polishing of a shallow trench isolation structure
Grant 7,109,117 - Tseng , et al. September 19, 2 | 2006-09-19 |
In-line hot-wire sensor for slurry monitoring
Grant 7,016,790 - Tseng , et al. March 21, 2 | 2006-03-21 |
Method of forming a contact on a silicon-on-insulator wafer
Grant 6,930,040 - Hou , et al. August 16, 2 | 2005-08-16 |
Method for chemical mechanical polishing of a shallow trench isolation structure
App 20050153555 - Tseng, Tung-Ching ; et al. | 2005-07-14 |
Method of forming a contact on a silicon-on-insulator wafer
App 20050090096 - Hou, Chuan-Ping ; et al. | 2005-04-28 |
Method for improving semiconductor process wafer CMP uniformity while avoiding fracture
Grant 6,812,069 - Tseng , et al. November 2, 2 | 2004-11-02 |
Method for improving semiconductor process wafer CMP uniformity while avoiding fracture
App 20040115925 - Tseng, Tung-Ching ; et al. | 2004-06-17 |
In-line hot-wire sensor for slurry monitoring
App 20040083068 - Tseng, Tung-Ching ; et al. | 2004-04-29 |
Chemical mechanical polisher equipped with chilled retaining ring and method of using
Grant 6,686,284 - Chung , et al. February 3, 2 | 2004-02-03 |
Chemical mechanical polisher equipped with chilled retaining ring and method of using
App 20030148615 - Chung, Chi-Wei ; et al. | 2003-08-07 |
Retaining ring with active edge-profile control by piezoelectric actuator/sensors
App 20030027498 - Tseng, Tung-Ching ; et al. | 2003-02-06 |
Dual detection method for end point in chemical mechanical polishing
App 20030008597 - Tseng, Tung-Ching | 2003-01-09 |
Apparatus and method for controlling a flow of process material to a deposition chamber
Grant 6,176,930 - Koai , et al. January 23, 2 | 2001-01-23 |
| 