Tseng; Sheng-Tou
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tseng; Sheng-Tou.The latest application filed is for "semiconductor package having partial outer metal layer and packaging method thereof".
- Tseng; Sheng-Tou - Hsinchu TW
- TSENG; Sheng-Tou - Hukou TW
- Tseng; Sheng-Tou - Hsinchu County TW
- Tseng; Sheng-Tou - Hukou Township TW
| Patent | Date |
|---|---|
| Semiconductor package having partial outer metal layer and packaging method thereof Grant 11,410,945 - Chen , et al. August 9, 2 | 2022-08-09 |
| Semiconductor Package Having Partial Outer Metal Layer And Packaging Method Thereof App 20210288003 - CHEN; Shih-Chun ; et al. | 2021-09-16 |
| Chip Carrier Device App 20210217641 - CHEN; Shih-Chun ; et al. | 2021-07-15 |
| Semiconductor Packaging Structure With Back-deposited Shielding Layer And Manufacturing Method Thereof App 20210217632 - CHEN; Shih-Chun ; et al. | 2021-07-15 |
| Flux Transfer Tool And Flux Transfer Method App 20190275600 - Hsu; Kun-Chi ; et al. | 2019-09-12 |
| Flux Transfer Tool And Flux Transfer Method App 20190267346 - Hsu; Kun-Chi ; et al. | 2019-08-29 |
| Flux Transfer Method App 20190247944 - Hsu; Kun-Chi ; et al. | 2019-08-15 |
| Laser Color Marking Method For A Semiconductor Package App 20190229064 - Wu; Chin-Ta ; et al. | 2019-07-25 |
| Method For Laser Marking App 20190134742 - Fang; Yun-Chieh ; et al. | 2019-05-09 |
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