Tseng; Richard
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tseng; Richard.The latest application filed is for "heat dissipating device for electronic component".
- Tseng; Richard - Fullerton CA
- Tseng; Richard - Lacey WA
Trademarks
| Patent | Date |
|---|---|
| Heat dissipating device for electronic component Grant 7,304,854 - Tseng , et al. December 4, 2 | 2007-12-04 |
| Heat dissipating device for electronic component App 20060232943 - Tseng; Richard ; et al. | 2006-10-19 |
| Vent chimney heat sink design for an electrical assembly Grant 6,046,906 - Tseng April 4, 2 | 2000-04-04 |
| Electrical assembly that includes a heat sink which is attached to a substrate by a clip Grant 6,043,984 - Tseng March 28, 2 | 2000-03-28 |
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