Tseng; Ming-Hung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tseng; Ming-Hung.The latest application filed is for "packaged semiconductor devices with wireless charging means".
Company Profile
46.66.81
- Tseng; Ming-Hung - Miaoli County TW
- TSENG; Ming-Hung - Toufen Township TW
- TSENG; Ming-Hung - Taipei TW
- Tseng; Ming-Hung - Miaoli TW
- Tseng, Ming-Hung - Miaoli City TW
Patent Activity
| Patent | Date |
|---|---|
| Semiconductor device and method of manufacturing the same Grant 11,410,932 - Tseng , et al. August 9, 2 | 2022-08-09 |
| Semiconductor Structure And Method Of Fabricating The Same App 20220165675 - Huang; Tzu-Sung ; et al. | 2022-05-26 |
| Packaged Semiconductor Devices With Wireless Charging Means App 20220166254 - YU; Chen-Hua ; et al. | 2022-05-26 |
| Integrated Circuit Package and Method App 20220139839 - Yu; Chen-Hua ; et al. | 2022-05-05 |
| Wireless charging package with chip integrated in coil center Grant 11,282,785 - Yu , et al. March 22, 2 | 2022-03-22 |
| Package structure, package-on-package structure and method of fabricating the same Grant 11,251,119 - Yu , et al. February 15, 2 | 2022-02-15 |
| Packaged semiconductor devices with wireless charging means Grant 11,251,644 - Yu , et al. February 15, 2 | 2022-02-15 |
| Semiconductor structure and method of fabricating the same Grant 11,244,906 - Huang , et al. February 8, 2 | 2022-02-08 |
| Integrated circuit package and method Grant 11,227,837 - Yu , et al. January 18, 2 | 2022-01-18 |
| Semiconductor Structure And Method Of Fabricating The Same App 20210366833 - Huang; Tzu-Sung ; et al. | 2021-11-25 |
| Semiconductor Device and Method App 20210358870 - Huang; Tzu-Sung ; et al. | 2021-11-18 |
| Semiconductor Device And Method Of Manufacturing The Same App 20210305164 - Tseng; Ming-Hung ; et al. | 2021-09-30 |
| Semiconductor package and manufacturing method thereof Grant 11,133,269 - Lu , et al. September 28, 2 | 2021-09-28 |
| Die Stacking Structure and Method Forming Same App 20210288040 - Yu; Chen-Hua ; et al. | 2021-09-16 |
| Semiconductor device and method Grant 11,075,176 - Huang , et al. July 27, 2 | 2021-07-27 |
| Semiconductor Packages And Methods Of Forming The Same App 20210225812 - Yu; Chen-Hua ; et al. | 2021-07-22 |
| Integrated Circuit Package and Method App 20210225723 - Huang; Tzu-Sung ; et al. | 2021-07-22 |
| Integrated Circuit Package and Method App 20210193582 - Yu; Chen-Hua ; et al. | 2021-06-24 |
| Semiconductor structure Grant 11,004,811 - Chen , et al. May 11, 2 | 2021-05-11 |
| Semiconductor Package And Manufacturing Method Thereof App 20210118811 - Lu; Chun-Ti ; et al. | 2021-04-22 |
| Semiconductor packages and methods of forming the same Grant 10,971,477 - Yu , et al. April 6, 2 | 2021-04-06 |
| Package Structure, Package-on-package Structure And Method Of Fabricating The Same App 20210090993 - Yu; Tsung-Yuan ; et al. | 2021-03-25 |
| Integrated circuit package and method Grant 10,950,519 - Huang , et al. March 16, 2 | 2021-03-16 |
| InFO Coil on Metal Plate with Slot App 20210057144 - Wang; Chuei-Tang ; et al. | 2021-02-25 |
| Semiconductor Package and Method App 20210005554 - Huang; Tzu-Sung ; et al. | 2021-01-07 |
| Package-on-package structure Grant 10,879,221 - Lu , et al. December 29, 2 | 2020-12-29 |
| InFO coil structure and methods of manufacturing same Grant 10,867,911 - Yu , et al. December 15, 2 | 2020-12-15 |
| Substrate pad structure Grant 10,867,810 - Liu , et al. December 15, 2 | 2020-12-15 |
| Semiconductor Structure App 20200388584 - CHEN; VINCENT ; et al. | 2020-12-10 |
| Integrated Circuit Package and Method App 20200381325 - Huang; Tzu-Sung ; et al. | 2020-12-03 |
| InFO coil on metal plate with slot Grant 10,847,304 - Wang , et al. November 24, 2 | 2020-11-24 |
| Package-on-package Structure App 20200365569 - Lu; Chun-Ti ; et al. | 2020-11-19 |
| Wireless Charging Devices Having Wireless Charging Coils and Methods of Manufacture Thereof App 20200350782 - Yu; Chen-Hua ; et al. | 2020-11-05 |
| Stacked coil for wireless charging structure on InFO package Grant 10,825,602 - Yu , et al. November 3, 2 | 2020-11-03 |
| Wireless Charging Package with Chip Integrated in Coil Center App 20200343181 - Yu; Chen-Hua ; et al. | 2020-10-29 |
| Semiconductor device and method Grant 10,790,244 - Huang , et al. September 29, 2 | 2020-09-29 |
| Semiconductor package and method Grant 10,784,203 - Huang , et al. Sept | 2020-09-22 |
| Elongated bump structures in package structure Grant 10,784,223 - Chuang , et al. Sept | 2020-09-22 |
| Semiconductor structure Grant 10,763,229 - Chen , et al. Sep | 2020-09-01 |
| Packaged Semiconductor Devices With Wireless Charging Means App 20200266664 - YU; Chen-Hua ; et al. | 2020-08-20 |
| Substrate pad structure Grant 10,748,785 - Liu , et al. A | 2020-08-18 |
| Wireless charging package with chip integrated in coil center Grant 10,720,388 - Yu , et al. | 2020-07-21 |
| Wireless charging devices having wireless charging coils and methods of manufacture thereof Grant 10,720,788 - Yu , et al. | 2020-07-21 |
| Packaged semiconductor devices with wireless charging means Grant 10,651,675 - Yu , et al. | 2020-05-12 |
| Hexagonal Semiconductor Package Structure App 20200144861 - Huang; Tzu-Sung ; et al. | 2020-05-07 |
| Stacked Coil for Wireless Charging Structure on InFO Package App 20200090855 - Yu; Chen-Hua ; et al. | 2020-03-19 |
| Semiconductor Structure App 20200075516 - CHEN; VINCENT ; et al. | 2020-03-05 |
| Dual-mode Wireless Charging Device App 20200066635 - LIANG; Shih-Wei ; et al. | 2020-02-27 |
| Substrate Pad Structure App 20200013710 - Liu; Hao-Juin ; et al. | 2020-01-09 |
| Hexagonal semiconductor package structure Grant 10,530,175 - Huang , et al. J | 2020-01-07 |
| Semiconductor Device and Method App 20200006259 - Huang; Tzu-Sung ; et al. | 2020-01-02 |
| Stacked coil for wireless charging structure on InFO package Grant 10,510,478 - Yu , et al. Dec | 2019-12-17 |
| Method For Manufacturing Semiconductor Device App 20190371718 - TSENG; HUA-WEI ; et al. | 2019-12-05 |
| Dual-mode wireless charging device Grant 10,497,646 - Liang , et al. De | 2019-12-03 |
| Semiconductor structure Grant 10,475,755 - Chen , et al. Nov | 2019-11-12 |
| Stacked Coil for Wireless Charging Structure on InFO Package App 20190279810 - Yu; Chen-Hua ; et al. | 2019-09-12 |
| Semiconductor Packages and Methods of Forming the Same App 20190244935 - Yu; Chen-Hua ; et al. | 2019-08-08 |
| Stacked coil for wireless charging structure on InFO package Grant 10,304,614 - Yu , et al. | 2019-05-28 |
| Semiconductor Package and Method App 20190148301 - Huang; Tzu-Sung ; et al. | 2019-05-16 |
| Info coil structure and methods of manufacturing same Grant 10,269,702 - Yu , et al. | 2019-04-23 |
| Stacked coil for wireless charging structure on InFO package Grant 10,269,481 - Yu , et al. | 2019-04-23 |
| Thermally enhanced package-on-package (PoP) Grant 10,269,676 - Chiang , et al. | 2019-04-23 |
| Semiconductor packages and methods of forming the same Grant 10,269,773 - Yu , et al. | 2019-04-23 |
| Semiconductor Device and Method App 20190103370 - Huang; Tzu-Sung ; et al. | 2019-04-04 |
| Semiconductor Packages and Methods of Forming the Same App 20190103379 - Yu; Chen-Hua ; et al. | 2019-04-04 |
| Stacked Coil for Wireless Charging Structure on InFO Package App 20190096565 - Yu; Chen-Hua ; et al. | 2019-03-28 |
| Wireless Charging Package with Chip Integrated in Coil Center App 20190088595 - Yu; Chen-Hua ; et al. | 2019-03-21 |
| Semiconductor Structure App 20190067222 - CHEN; VINCENT ; et al. | 2019-02-28 |
| Packaged Semiconductor Devices With Wireless Charging Means App 20190020212 - YU; Chen-Hua ; et al. | 2019-01-17 |
| InFO Coil on Metal Plate with Slot App 20190006085 - Wang; Chuei-Tang ; et al. | 2019-01-03 |
| Wireless charging package with chip integrated in coil center Grant 10,163,780 - Yu , et al. Dec | 2018-12-25 |
| InFO Coil Structure and Methods of Manufacturing Same App 20180331032 - Yu; Chen-Hua ; et al. | 2018-11-15 |
| Fan-out package structure, antenna system and associated method Grant 10,128,203 - Chen , et al. November 13, 2 | 2018-11-13 |
| Method of manufacturing a semiconductor structure Grant 10,115,685 - Chen , et al. October 30, 2 | 2018-10-30 |
| Packaged semiconductor devices with wireless charging means Grant 10,097,030 - Yu , et al. October 9, 2 | 2018-10-09 |
| InFO coil on metal plate with slot Grant 10,074,472 - Wang , et al. September 11, 2 | 2018-09-11 |
| Method Of Manufacturing A Semiconductor Structure App 20180226368 - CHEN; VINCENT ; et al. | 2018-08-09 |
| Method for manufacturing semiconductor package structure Grant 10,037,973 - Tseng , et al. July 31, 2 | 2018-07-31 |
| Connector structures of integrated circuits Grant 9,991,218 - Tu , et al. June 5, 2 | 2018-06-05 |
| Semiconductor structure and manufacturing method thereof Grant 9,953,936 - Chen , et al. April 24, 2 | 2018-04-24 |
| Hexagonal Semiconductor Package Structure App 20180048177 - Huang; Tzu-Sung ; et al. | 2018-02-15 |
| Elongated Bump Structures in Package Structure App 20180047690 - Chuang; Yao-Chun ; et al. | 2018-02-15 |
| Dual-mode Wireless Charging Device App 20180033725 - LIANG; Shih-Wei ; et al. | 2018-02-01 |
| Cooling channels in 3DIC stacks Grant 9,859,252 - Ching , et al. January 2, 2 | 2018-01-02 |
| Wireless Charging Package with Chip Integrated in Coil Center App 20170373004 - Yu; Chen-Hua ; et al. | 2017-12-28 |
| Substrate Pad Structure App 20170345677 - Liu; Hao-Juin ; et al. | 2017-11-30 |
| Stacked Coil for Wireless Charging Structure on InFO Package App 20170345548 - Yu; Chen-Hua ; et al. | 2017-11-30 |
| Packaged Semiconductor Devices With Wireless Charging Means App 20170317023 - YU; Chen-Hua ; et al. | 2017-11-02 |
| Elongated bump structures in package structure Grant 9,786,621 - Chuang , et al. October 10, 2 | 2017-10-10 |
| Wireless charging package with chip integrated in coil center Grant 9,761,522 - Chu , et al. September 12, 2 | 2017-09-12 |
| Apparatus and method for a component package Grant 9,748,216 - Chen , et al. August 29, 2 | 2017-08-29 |
| Substrate pad structure Grant 9,741,589 - Liu , et al. August 22, 2 | 2017-08-22 |
| Method of Manufacturing Connector Structures of Integrated Circuits App 20170229413 - Tu; Shang-Yun ; et al. | 2017-08-10 |
| Wireless Charging Package with Chip Integrated in Coil Center App 20170221819 - Chu; Chiang-Jui ; et al. | 2017-08-03 |
| Fan-out Package Structure, Antenna System And Associated Method App 20170221838 - CHEN; WEI-TING ; et al. | 2017-08-03 |
| Info Coil Structure and Methods of Manufacturing Same App 20170221820 - Yu; Chen-Hua ; et al. | 2017-08-03 |
| InFO Coil on Metal Plate with Slot App 20170171979 - Wang; Chuei-Tang ; et al. | 2017-06-15 |
| Method of manufacturing connector structures of integrated circuits Grant 9,659,903 - Tu , et al. May 23, 2 | 2017-05-23 |
| Semiconductor Structure And Manufacturing Method Thereof App 20170126047 - CHEN; VINCENT ; et al. | 2017-05-04 |
| Wireless Charging Devices, Methods of Manufacture Thereof, and Charging Methods App 20170104356 - Yu; Chen-Hua ; et al. | 2017-04-13 |
| Method For Manufacturing Semiconductor Package Structure App 20160336298 - TSENG; HUA-WEI ; et al. | 2016-11-17 |
| Cooling Channels in 3DIC Stacks App 20160276314 - Ching; Kai-Ming ; et al. | 2016-09-22 |
| Connector Structures of Integrated Circuits App 20160268227 - Tu; Shang-Yun ; et al. | 2016-09-15 |
| Semiconductor package structure and manufacturing method thereof Grant 9,406,629 - Tseng , et al. August 2, 2 | 2016-08-02 |
| Connector structures of integrated circuits Grant 9,373,598 - Tu , et al. June 21, 2 | 2016-06-21 |
| Cooling channels in 3DIC stacks Grant 9,355,933 - Ching , et al. May 31, 2 | 2016-05-31 |
| Semiconductor Package Structure And Manufacturing Method Thereof App 20160111384 - TSENG; HUA-WEI ; et al. | 2016-04-21 |
| Semiconductor Device And Manufacturing Method Thereof App 20160064340 - TSENG; HUA-WEI ; et al. | 2016-03-03 |
| Elongated Bump Structures in Package Structure App 20160027752 - Chuang; Chita ; et al. | 2016-01-28 |
| Substrate Pad Structure App 20150318188 - Liu; Hao-Juin ; et al. | 2015-11-05 |
| Connector Structures of Integrated Circuits App 20150303160 - Tu; Shang-Yun ; et al. | 2015-10-22 |
| Elongated bump structures in package structure Grant 9,159,695 - Chuang , et al. October 13, 2 | 2015-10-13 |
| Substrate pad structure Grant 9,117,825 - Liu , et al. August 25, 2 | 2015-08-25 |
| Connector structures of integrated circuits Grant 9,093,440 - Tu , et al. July 28, 2 | 2015-07-28 |
| Packaging methods and packaged devices Grant 9,059,107 - Pan , et al. June 16, 2 | 2015-06-16 |
| Bump interconnection techniques Grant 9,053,990 - Chuang , et al. June 9, 2 | 2015-06-09 |
| Surface Treatment Method For Implant App 20150118649 - HSU; Sheng-Hao ; et al. | 2015-04-30 |
| Apparatus and Method for a Component Package App 20150069595 - Chen; Chih-Hua ; et al. | 2015-03-12 |
| Semiconductor devices, packaging methods and structures Grant 8,916,969 - Chen , et al. December 23, 2 | 2014-12-23 |
| Apparatus and method for a component package Grant 8,889,484 - Chen , et al. November 18, 2 | 2014-11-18 |
| Connector Structures of Integrated Circuits App 20140231987 - Tu; Shang-Yun ; et al. | 2014-08-21 |
| Elongated Bump Structures In Package Structure App 20140191391 - Chuang; Yao-Chun ; et al. | 2014-07-10 |
| Dummy metal design for packaging structures Grant 8,753,971 - Liu , et al. June 17, 2 | 2014-06-17 |
| Substrate Pad Structure App 20140159203 - Liu; Hao-Juin ; et al. | 2014-06-12 |
| Connector structures of integrated circuits Grant 8,729,699 - Tu , et al. May 20, 2 | 2014-05-20 |
| Bump Interconnection Ratio for Robust CPI Window App 20140117532 - Chuang; Chita ; et al. | 2014-05-01 |
| Cooling Channels in 3DIC Stacks App 20140103540 - Ching; Kai-Ming ; et al. | 2014-04-17 |
| Thermally Enhanced Package-on-Package (PoP) App 20140097532 - Chiang; Tsung-Hsien ; et al. | 2014-04-10 |
| Apparatus and Method for a Component Package App 20140091471 - Chen; Chih-Hua ; et al. | 2014-04-03 |
| Packaging Methods and Packaged Devices App 20140070403 - Pan; Kuo Lung ; et al. | 2014-03-13 |
| Connector Structures of Integrated Circuits App 20130093079 - Tu; Shang-Yun ; et al. | 2013-04-18 |
| Semiconductor Devices, Packaging Methods and Structures App 20130026623 - Chen; Yu-Ren ; et al. | 2013-01-31 |
| Dummy Metal Design for Packaging Structures App 20120178252 - Liu; Tzuan-Horng ; et al. | 2012-07-12 |
| Dummy metal design for packaging structures Grant 8,193,639 - Liu , et al. June 5, 2 | 2012-06-05 |
| Dummy Metal Design for Packaging Structures App 20110241202 - Liu; Tzuan-Horng ; et al. | 2011-10-06 |
| Under-Bump Metallization Structure for Semiconductor Devices App 20110227216 - Tseng; Ming-Hung ; et al. | 2011-09-22 |
| Structure and method for forming pillar bump structure having sidewall protection Grant 7,919,406 - Tseng , et al. April 5, 2 | 2011-04-05 |
| Structure And Method For Forming Pillar Bump Structure Having Sidewall Protection App 20110006416 - TSENG; Ming Hung ; et al. | 2011-01-13 |
| Piezoelectric o-ring transducer Grant 7,180,227 - Tseng , et al. February 20, 2 | 2007-02-20 |
| Piezoelectric o-ring transducer App 20050156487 - Tseng, Ming-Hung ; et al. | 2005-07-21 |
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