Tseng; Ming-Hong

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tseng; Ming-Hong.The latest application filed is for "super capacitor and method for manufacturing the same".

Company Profile

0.6.5

Tseng; Ming-Hong - Taichung City TW
Tseng; Ming-Hong - Miaoli N/A TW
Tseng; Ming-Hong - Toufen Township TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Super Capacitor And Method For Manufacturing The Same App 20140268490 - Tsai; Feng-Yu ; et al.	2014-09-18
Cooling channels in 3DIC stacks Grant 8,624,360 - Ching , et al. January 7, 2	2014-01-07
Through-silicon via formed with a post passivation interconnect structure Grant 8,390,125 - Tseng , et al. March 5, 2	2013-03-05
Three-dimensional integrated circuit stacking-joint interface structure Grant 8,097,953 - Tseng , et al. January 17, 2	2012-01-17
Through-silicon Via Formed With A Post Passivation Interconnect Structure App 20110169168 - TSENG; Ming-Hong ; et al.	2011-07-14
Through-silicon via formed with a post passivation interconnect structure Grant 7,932,608 - Tseng , et al. April 26, 2	2011-04-26
Through-silicon Via Formed With A Post Passivation Interconnect Structure App 20100213612 - Tseng; Ming-Hong ; et al.	2010-08-26
Cooling Channels in 3DIC Stacks App 20100117201 - Ching; Kai-Ming ; et al.	2010-05-13
Three-Dimensional Integrated Circuit Stacking-Joint Interface Structure App 20100102453 - Tseng; Ming-Hong ; et al.	2010-04-29

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