Tseng; Li-Hsin
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tseng; Li-Hsin.The latest application filed is for "handset unit and telephone device".
- Tseng; Li-Hsin - Jhubei TW
- Tseng; Li-Hsin - Hsinchu N/A TW
- Tseng; Li Hsin - Taipei City TW
- Tseng; Li Hsin - Taipei TW
- Tseng; Li-Hsin - Taichung TW
- TSENG; LI-HSIN - Jhubei City TW
- Tseng; Li-Hsin - Taichung City TW
| Patent | Date |
|---|---|
| Crosstalk-free WLCSP structure for high frequency application Grant 8,669,658 - Tsai , et al. March 11, 2 | 2014-03-11 |
| Compact camera module Grant 8,355,628 - Shiung , et al. January 15, 2 | 2013-01-15 |
| Handset Unit And Telephone Device App 20120252526 - LAM; TAI-SENG ; et al. | 2012-10-04 |
| Handset Unit And Telephone Device App 20120243677 - LAM; TAI-SENG ; et al. | 2012-09-27 |
| Electronic device package with electromagnetic compatibility (EMC) coating thereon Grant 7,964,936 - Shiung , et al. June 21, 2 | 2011-06-21 |
| Compact Camera Module App 20100226633 - SHIUNG; Shin-Chang ; et al. | 2010-09-09 |
| Electronic Device Package With Electromagnetic Compatibility (emc) Coating Thereon App 20100006965 - Shiung; Shin-Chang ; et al. | 2010-01-14 |
| Crosstalk-Free WLCSP Structure for High Frequency Application App 20090026608 - Tsai; Mon-Chin ; et al. | 2009-01-29 |
| Through-silicon via interconnection formed with a cap layer App 20080303154 - Huang; Hon-Lin ; et al. | 2008-12-11 |
| Method for forming solder bumps of increased height Grant 7,459,386 - Tseng , et al. December 2, 2 | 2008-12-02 |
| UBM structure for strengthening solder bumps App 20080251916 - CHENG; CHIU SUNG ; et al. | 2008-10-16 |
| Bump structure Grant 7,187,078 - Lin , et al. March 6, 2 | 2007-03-06 |
| Method for fabricating pad redistribution layer Grant 7,122,458 - Cheng , et al. October 17, 2 | 2006-10-17 |
| Method for forming solder bumps of increased height App 20060105560 - Tseng; Li-Hsin ; et al. | 2006-05-18 |
| Ubm Structure For Improving Reliability And Performance App 20060087039 - CHENG; CHIU SUNG ; et al. | 2006-04-27 |
| Bump structure App 20060055035 - Lin; Tzu-Han ; et al. | 2006-03-16 |
| Method for fabricating pad redistribution layer App 20060019480 - Cheng; Chia-Jen ; et al. | 2006-01-26 |
| Method of making a bump on a substrate without ribbon residue Grant 6,696,356 - Tseng , et al. February 24, 2 | 2004-02-24 |
| Method of making a bump on a substrate without ribbon residue App 20030124832 - Tseng, Li-Hsin ; et al. | 2003-07-03 |
| Method to achieve robust solder bump height Grant 6,486,054 - Fan , et al. November 26, 2 | 2002-11-26 |
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