Tseng; Feng-Po

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tseng; Feng-Po.The latest application filed is for "reversible crosslinking reactant composition".

Company Profile

3.9.11

Tseng; Feng-Po - Taoyuan TW
TSENG; Feng-Po - Taoyuan City TW
Tseng; Feng-Po - Taoyuan County TW
Tseng; Feng-Po - Hsinchu TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Reversible crosslinking reactant composition Grant 11,247,978 - Chuang , et al. February 15, 2	2022-02-15
Reversible Crosslinking Reactant Composition App 20210047282 - CHUANG; Kuei-Yi ; et al.	2021-02-18
Furan-modified compound and oligomer Grant 10,894,853 - Chuang , et al. January 19, 2	2021-01-19
Reversible crosslinking reactant composition Grant 10,858,471 - Chuang , et al. December 8, 2	2020-12-08
Thermally conductive resin, resin composition, prepreg, and copper clad laminate Grant 10,752,744 - Tseng , et al. A	2020-08-25
Polymers and resin composition employing the same Grant 10,626,219 - Chuang , et al.	2020-04-21
Thermally Conductive Resin, Resin Composition, Prepreg, And Copper Clad Laminate App 20190194408 - TSENG; Feng-Po ; et al.	2019-06-27
Reversible Crosslinking Reactant Composition App 20190153139 - CHUANG; Kuei-Yi ; et al.	2019-05-23
Furan-modified Compound And Oligomer App 20190144410 - CHUANG; Kuei-Yi ; et al.	2019-05-16
Polymers And Resin Composition Employing The Same App 20180134847 - CHUANG; Kuei-Yi ; et al.	2018-05-17
Resin formulations, resin polymers and composite materials comprising the resin polymers Grant 9,708,437 - Chuang , et al. July 18, 2	2017-07-18
Resin Formulations, Resin Polymers And Composite Materials Comprising The Resin Polymers App 20160145373 - CHUANG; Kuei-Yi ; et al.	2016-05-26
Modified bismaleimide resins, preparation method thereof and compositions comprising the same Grant 8,039,537 - Tseng , et al. October 18, 2	2011-10-18
Modified Bismaleimide Resins, Preparation Method Thereof And Compositions Comprising The Same App 20110147646 - Tseng; Feng-Po ; et al.	2011-06-23
Halogen-free and thermal resistant composition Grant 7,834,070 - Tseng , et al. November 16, 2	2010-11-16
Encapsulation Composition For Pressure Signal Transmission And Sensor App 20090235754 - Tseng; Feng-Po ; et al.	2009-09-24
Halogen-free and thermal resistant composition App 20080146706 - Tseng; Feng-Po ; et al.	2008-06-19
Encapsulation composition for pressure signal transmission and sensor App 20070148469 - Tseng; Feng-Po ; et al.	2007-06-28
Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same Grant 6,809,130 - Chiou , et al. October 26, 2	2004-10-26
Halogen-free, phosphorus-free flame-retardant advanced epoxy resin and an epoxy composition containing the same App 20040110874 - Chiou, Kuo-Chan ; et al.	2004-06-10

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