Tseng; Fan Chung
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tseng; Fan Chung.The latest application filed is for "dual damascene copper process using a selected mask".
- Tseng; Fan Chung - Shanghai N/A CN
- Tseng; Fan-Chung - Hsinchu TW
- Tseng; Fan Chung - Hsinchu City TW
| Patent | Date |
|---|---|
| Dual damascene copper process using a selected mask Grant 8,685,853 - Tseng , et al. April 1, 2 | 2014-04-01 |
| Dual Damascene Copper Process Using a Selected Mask App 20120108054 - Tseng; Fan Chung ; et al. | 2012-05-03 |
| Dual damascence copper process using a selected mask Grant 7,989,341 - Tseng , et al. August 2, 2 | 2011-08-02 |
| Dual Damascene Copper Process Using a Selected Mask App 20080020565 - Tseng; Fan Chung ; et al. | 2008-01-24 |
| Fluid ejection apparatus Grant 7,222,945 - Tseng , et al. May 29, 2 | 2007-05-29 |
| Fluid Injection Apparatus And Fabrication Method Thereof App 20070117367 - Shyn; Der Rong ; et al. | 2007-05-24 |
| Fluid Injection Apparatus App 20070109361 - Chen; Wei Lin ; et al. | 2007-05-17 |
| Fluid ejection apparatus App 20070024673 - Tseng; Fan-Chung ; et al. | 2007-02-01 |
| Fluid ejection apparatus App 20040263576 - Tseng, Fan-Chung ; et al. | 2004-12-30 |
| Ink filling method App 20040165048 - Ma, Kuo-Tong ; et al. | 2004-08-26 |
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