TSENG; Ching-Lin

Patent Applications and Registrations

Patent applications and USPTO patent grants for TSENG; Ching-Lin.The latest application filed is for "laser cutting method for a wafer".

Company Profile

0.4.8

TSENG; Ching-Lin - Hukou Township TW
Tseng; Ching-Lin - Taipei Hsien TW
Tseng; Ching-Lin - Pan Chiao City TW
Tseng; Ching Lin - Pan Chiao TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Laser Cutting Method For A Wafer App 20210339338 - CHIU; Chui-Liang ; et al.	2021-11-04
Light emitting diode lighting module and method for making the same Grant 8,157,415 - Tseng , et al. April 17, 2	2012-04-17
Planar light source device Grant 8,154,029 - Liao , et al. April 10, 2	2012-04-10
Lighting device and method for making the same Grant 8,100,558 - Tseng , et al. January 24, 2	2012-01-24
Lighting Device And Method For Making The Same App 20100181890 - Tseng; Ching-Lin ; et al.	2010-07-22
Planar Light Source Device App 20090242908 - Liao; Tsung-Jen ; et al.	2009-10-01
Light Emitting Diode Lighting Module And Method For Making The Same App 20090231849 - TSENG; Ching-Lin ; et al.	2009-09-17
Solid state lighting device with heat-dissipating capability App 20090010011 - Tseng; Ching-Lin ; et al.	2009-01-08
Light Emitting Device With High Heat-dissipating Capability App 20080061314 - Liaw; Tsung-Jen ; et al.	2008-03-13
Light-emitting Device And A Lens Thereof App 20070217195 - Chen; Yen-Cheng ; et al.	2007-09-20
SMD(surface mount device)-type light emitting diode with high heat dissipation efficiency and high power Grant 7,081,645 - Chen , et al. July 25, 2	2006-07-25
SMD(surface mount device)-type light emitting diode with high heat dissipation efficiency and high power App 20060076570 - Chen; Yen Cheng ; et al.	2006-04-13

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