Tseng; Chin-Yuan
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tseng; Chin-Yuan.The latest application filed is for "method of making semiconductor device which includes fins".
Company Profile
18.18.21
- Tseng; Chin-Yuan - Taipei TW
- TSENG; Chin-Yuan - Hsinchu TW
- TSENG; Chin-Yuan - Taipei City TW
- Tseng; Chin-Yuan - Hsin-Chu TW
- TSENG; CHIN-YUAN - Kaohsiung TW
Patent Activity
| Patent | Date |
|---|---|
| Method for forming semiconductor device structure Grant 11,437,239 - Lai , et al. September 6, 2 | 2022-09-06 |
| Method Of Making Semiconductor Device Which Includes Fins App 20220108990 - CHEN; Chih-Liang ; et al. | 2022-04-07 |
| Semiconductor device which includes fins and method of making same Grant 11,222,899 - Chen , et al. January 11, 2 | 2022-01-11 |
| Fin patterning methods for increased process margins Grant 11,081,354 - Tseng , et al. August 3, 2 | 2021-08-03 |
| Method For Forming Semiconductor Device Structure App 20210225649 - LAI; Chih-Ming ; et al. | 2021-07-22 |
| High-Density Semiconductor Device App 20210166947 - Chou; Lei-Chun ; et al. | 2021-06-03 |
| Method for forming semiconductor device structure Grant 10,971,363 - Lai , et al. April 6, 2 | 2021-04-06 |
| Fin-like field effect transistor patterning methods for increasing process margins Grant 10,957,551 - Tseng , et al. March 23, 2 | 2021-03-23 |
| High-density semiconductor device Grant 10,950,456 - Chou , et al. March 16, 2 | 2021-03-16 |
| Semiconductor Device Which Includes Fins And Method Of Making Same App 20200335507 - CHEN; Chih-Liang ; et al. | 2020-10-22 |
| Semiconductor device which includes Fins Grant 10,714,485 - Chen , et al. | 2020-07-14 |
| Fin Patterning Methods for Increased Process Margins App 20200152464 - Tseng; Chin-Yuan ; et al. | 2020-05-14 |
| Method For Forming Semiconductor Device Structure App 20200066523 - LAI; Chih-Ming ; et al. | 2020-02-27 |
| High-Density Semiconductor Device App 20200043741 - Chou; Lei-Chun ; et al. | 2020-02-06 |
| Fin patterning methods for increased process margins Grant 10,535,520 - Tseng , et al. Ja | 2020-01-14 |
| Fin-Like Field Effect Transistor Patterning Methods for Increasing Process Margins App 20200013630 - Tseng; Chin-Yuan ; et al. | 2020-01-09 |
| Method for forming semiconductor device structure Grant 10,497,565 - Lai , et al. De | 2019-12-03 |
| High-density semiconductor device Grant 10,446,406 - Chou , et al. Oc | 2019-10-15 |
| Fin-like field effect transistor patterning methods for increasing process margins Grant 10,418,252 - Tseng , et al. Sept | 2019-09-17 |
| Lithographic technique incorporating varied pattern materials Grant 10,312,109 - Tseng , et al. | 2019-06-04 |
| Method Of Patterning App 20190164772 - TSENG; Chin-Yuan ; et al. | 2019-05-30 |
| Method For Forming Semiconductor Device Structure App 20190157085 - LAI; Chih-Ming ; et al. | 2019-05-23 |
| Semiconductor Device Which Includes Fins App 20190019797 - CHEN; Chih-Liang ; et al. | 2019-01-17 |
| Fin Patterning Methods for Increased Process Margins App 20180315602 - Tseng; Chin-Yuan ; et al. | 2018-11-01 |
| Lithographic Technique Incorporating Varied Pattern Materials App 20180286698 - Tseng; Chin-Yuan ; et al. | 2018-10-04 |
| Method of manufacturing fins and semiconductor device which includes fins Grant 10,074,657 - Chen , et al. September 11, 2 | 2018-09-11 |
| Fin-Like Field Effect Transistor Patterning Methods for Increasing Process Margins App 20180174854 - Tseng; Chin-Yuan ; et al. | 2018-06-21 |
| Lithographic technique incorporating varied pattern materials Grant 9,991,132 - Tseng , et al. June 5, 2 | 2018-06-05 |
| High-Density Semiconductor Device App 20180151381 - Chou; Lei-Chun ; et al. | 2018-05-31 |
| Method Of Manufacturing Fins And Semiconductor Device Which Includes Fins App 20170317089 - CHEN; Chih-Liang ; et al. | 2017-11-02 |
| High fin cut fabrication process Grant 9,679,994 - Chou , et al. June 13, 2 | 2017-06-13 |
| Method for integrated circuit manufacturing Grant 9,672,320 - Chang , et al. June 6, 2 | 2017-06-06 |
| Method for Integrated Circuit Manufacturing App 20170004242 - Chang; Shih-Ming ; et al. | 2017-01-05 |
| Multiple directed self-assembly patterning process Grant 9,530,660 - Tseng , et al. December 27, 2 | 2016-12-27 |
| Multiple Directed Self-Assembly Patterning Process App 20160336186 - Tseng; Chin-Yuan ; et al. | 2016-11-17 |
| Lithographic Technique Incorporating Varied Pattern Materials App 20160307769 - Tseng; Chin-Yuan ; et al. | 2016-10-20 |
| Fin patterning methods for increased process margin Grant 9,449,880 - Tseng , et al. September 20, 2 | 2016-09-20 |
| Fin Patterning Methods For Increased Process Margin App 20160254191 - Tseng; Chin-Yuan ; et al. | 2016-09-01 |
| Chip Resistor Having Low Resistance And Method For Manufacturing The Same App 20110234365 - YANG; CHIH-CHUNG ; et al. | 2011-09-29 |
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