Tseng; Chen-Wei

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tseng; Chen-Wei.The latest application filed is for "structure and manufacturing method of heat dissipation substrate and package structure and method thereof".

Company Profile

2.8.3

Tseng; Chen-Wei - New Taipei TW
Tseng; Chen-Wei - New Taipei City TW
Tseng; Chen Wei - Longmont CO

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Structure and manufacturing method of heat dissipation substrate and package structure and method thereof Grant 10,497,847 - Liu , et al. De	2019-12-03
Structure And Manufacturing Method Of Heat Dissipation Substrate And Package Structure And Method Thereof App 20190067543 - Liu; Wen-Fang ; et al.	2019-02-28
Chip Package Circuit Board Module App 20180368263 - Liu; Wen-Fang ; et al.	2018-12-20
Chip package circuit board module Grant 10,159,151 - Liu , et al. Dec	2018-12-18
Chip package circuit board module Grant 10,056,356 - Liu , et al. August 21, 2	2018-08-21
Circuit Board And Manufacturing Method Thereof App 20170196095 - Chang; Hung-Lin ; et al.	2017-07-06
Self-checking and self-correcting internal configuration port circuitry Grant 8,099,625 - Tseng , et al. January 17, 2	2012-01-17
Implementing a user design in a programmable logic device with single event upset mitigation Grant 7,650,585 - Miller , et al. January 19, 2	2010-01-19
Method and apparatus for configuring an integrated circuit Grant 7,626,415 - Tseng , et al. December 1, 2	2009-12-01
Method and apparatus for configuring an integrated circuit Grant 7,589,558 - Tseng , et al. September 15, 2	2009-09-15
Method and apparatus for mitigating one or more event upsets Grant 7,576,557 - Tseng , et al. August 18, 2	2009-08-18

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