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Tsay; Jeng-Yann Patent Filings

Tsay; Jeng-Yann

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsay; Jeng-Yann.The latest application filed is for "laser source device, extreme ultraviolet lithography device and method".

Company Profile
2.7.7
  • Tsay; Jeng-Yann - Tainan TW
  • TSAY; Jeng-Yann - Tainan City TW
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
EUV light source and apparatus for lithography
Grant 11,226,564 - Yeh , et al. January 18, 2
2022-01-18
Laser source device, extreme ultraviolet lithography device and method
Grant 11,158,989 - Tong , et al. October 26, 2
2021-10-26
Laser Source Device, Extreme Ultraviolet Lithography Device And Method
App 20200245443 - Kind Code
2020-07-30
Laser source device and extreme ultraviolet lithography device
Grant 10,624,196 - Tong , et al.
2020-04-14
Laser Source Device And Extreme Ultraviolet Lithography Device
App 20200107428 - TONG; Henry Yee-Shian ;   et al.
2020-04-02
Euv Light Source And Apparatus For Lithography
App 20200004159 - YEH; Jhan-Hong ;   et al.
2020-01-02
Method for sealing processing module
Grant 9,970,105 - Chen , et al. May 15, 2
2018-05-15
Method For Sealing Processing Module
App 20150179456 - CHEN; Chun-Ta ;   et al.
2015-06-25
System for decharging a wafer or substrate after dechucking from an electrostatic chuck
Grant 8,149,562 - Hsu , et al. April 3, 2
2012-04-03
System For Decharging A Wafer Or Substrate After Dechucking From An Electrostatic Chuck
App 20080218931 - Hsu; Yen-Hsiang ;   et al.
2008-09-11
Gas flow control system with interlock
Grant 7,354,555 - Yen , et al. April 8, 2
2008-04-08
Ultrasonic wafer blade vibration detecting
Grant 6,708,565 - Lin , et al. March 23, 2
2004-03-23
Gas flow control system with interlock
App 20030211015 - Yen, Chih-Pen ;   et al.
2003-11-13
Ultrasonic wafer blade vibration detection
App 20030200808 - Lin, Chein-Fang ;   et al.
2003-10-30

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