Tsau; Christine H.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsau; Christine H..The latest application filed is for "sealed mems devices with multiple chamber pressures".

Company Profile

0.14.14

Tsau; Christine H. - Medford MA
Tsau; Christine H. - Arlington MA
Tsau; Christine H. - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Sealed MEMS devices with multiple chamber pressures Grant 9,102,512 - Tsau , et al. August 11, 2	2015-08-11
Apparatus and method for forming alignment features for back side processing of a wafer Grant 9,105,644 - Tsau , et al. August 11, 2	2015-08-11
Sealed MEMS Devices with Multiple Chamber Pressures App 20150097253 - Tsau; Christine H. ; et al.	2015-04-09
Apparatus and method of wafer bonding using compatible alloy Grant 8,956,904 - Martin , et al. February 17, 2	2015-02-17
Apparatus and Method for Forming Alignment Features for Back Side Processing of a Wafer App 20150028499 - Tsau; Christine H. ; et al.	2015-01-29
Method for Creating Asperities in Metal for Metal-to-Metal Bonding App 20130288070 - Tsau; Christine H.	2013-10-31
Reduced stiction MEMS device with exposed silicon carbide Grant 8,507,306 - Chen , et al. August 13, 2	2013-08-13
Method of bonding wafers Grant 8,507,913 - Nunan , et al. August 13, 2	2013-08-13
Apparatus and Method of Wafer Bonding Using Compatible Alloy App 20130023082 - Martin; John R. ; et al.	2013-01-24
Substrate bonding with bonding material having rare earth metal Grant 8,304,861 - Martin , et al. November 6, 2	2012-11-06
Method of substrate bonding with bonding material having rare Earth metal Grant 8,293,582 - Martin , et al. October 23, 2	2012-10-23
Apparatus and method of wafer bonding using compatible alloy Grant 8,288,191 - Martin , et al. October 16, 2	2012-10-16
Barrier layer for fine-pitch mask-based substrate bumping Grant 8,183,692 - Nalla , et al. May 22, 2	2012-05-22
Method of Bonding Wafers App 20120074417 - Nunan; Thomas Kieran ; et al.	2012-03-29
Substrate Bonding with Bonding Material Having Rare Earth Metal App 20110241176 - Martin; John R. ; et al.	2011-10-06
Method of Substrate Bonding with Bonding Material Having Rare Earth Metal App 20110244630 - Martin; John R. ; et al.	2011-10-06
Apparatus and Method of Wafer Bonding Using Compatible Alloy App 20110212563 - Martin; John R. ; et al.	2011-09-01
Substrate bonding with bonding material having rare earth metal Grant 7,981,765 - Martin , et al. July 19, 2	2011-07-19
Apparatus and method of wafer bonding using compatible alloy Grant 7,943,411 - Martin , et al. May 17, 2	2011-05-17
Reduced Stiction MEMS Device with Exposed Silicon Carbide App 20110073859 - Chen; Li ; et al.	2011-03-31
Silicon-Rich Nitride Etch Stop Layer for Vapor HF Etching in MEMS Device Fabrication App 20100320548 - Tsau; Christine H. ; et al.	2010-12-23
Barrier Layer For Fine-pitch Mask-based Substrate Bumping App 20100276185 - Nalla; Ravi K. ; et al.	2010-11-04
Barrier layer for fine-pitch mask-based substrate bumping Grant 7,776,734 - Nalla , et al. August 17, 2	2010-08-17
Apparatus and Method of Wafer Bonding Using Compatible Alloy App 20100059835 - Martin; John R. ; et al.	2010-03-11
Substrate Bonding with Bonding Material Having Rare Earth Metal App 20100062565 - Martin; John R. ; et al.	2010-03-11
Barrier layer for fine-pitch mask-based substrate bumping App 20070275550 - Nalla; Ravi K. ; et al.	2007-11-29

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