| Patent | Date |
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Poisoned metal layer with sloped sidewall for making dual damascene interconnect
Grant 11,450,557 - Hsu , et al. September 20, 2 | 2022-09-20 |
Image sensing device and manufacturing method thereof
Grant 11,417,700 - Huang , et al. August 16, 2 | 2022-08-16 |
Method of forming deep trench isolation in radiation sensing substrate and image sensor device
Grant 11,404,470 - Lu , et al. August 2, 2 | 2022-08-02 |
Method of forming semiconductor device
Grant 11,387,274 - Lu , et al. July 12, 2 | 2022-07-12 |
Replacement Metal Gate Device Structure And Method Of Manufacturing Same
App 20220005697 - HSU; Min Han ; et al. | 2022-01-06 |
Poisoned Metal Layer With Sloped Sidewall For Making Dual Damascene Interconnect
App 20210210378 - HSU; Min Han ; et al. | 2021-07-08 |
Semiconductor Device And Method Of Forming The Same
App 20200402916 - LU; Chi-Ming ; et al. | 2020-12-24 |
Method of manufacturing semiconductor structure
Grant 10,867,889 - Fang , et al. December 15, 2 | 2020-12-15 |
Image Sensing Device And Manufacturing Method Thereof
App 20200373345 - HUANG; CHIH-CHANG ; et al. | 2020-11-26 |
Block layer in the metal gate of MOS devices
Grant 10,840,330 - Tsao , et al. November 17, 2 | 2020-11-17 |
Semiconductor device and method of forming the same
Grant 10,796,996 - Lu , et al. October 6, 2 | 2020-10-06 |
Image sensing device and manufacturing method thereof
Grant 10,741,601 - Huang , et al. A | 2020-08-11 |
Method of Forming Deep Trench Isolation in Radiation Sensing Substrate and Image Sensor Device
App 20200119081 - LU; Chi-Ming ; et al. | 2020-04-16 |
Method of Forming Semiconductor Device
App 20200083278 - LU; Chi-Ming ; et al. | 2020-03-12 |
Method of forming deep trench isolation in radiation sensing substrate and image sensor device
Grant 10,510,798 - Lu , et al. Dec | 2019-12-17 |
Semiconductor device having stress-neutralized film stack and method of fabricating same
Grant 10,475,847 - Lu , et al. Nov | 2019-11-12 |
Image Sensing Device And Manufacturing Method Thereof
App 20190148442 - HUANG; CHIH-CHANG ; et al. | 2019-05-16 |
Method Of Forming Deep Trench Isolation In Radiation Sensing Substrate And Image Sensor Device
App 20190043915 - Lu; Chi-Ming ; et al. | 2019-02-07 |
Method Of Manufacturing Semiconductor Structure
App 20190019743 - FANG; LI-YEN ; et al. | 2019-01-17 |
Image sensing device and manufacturing method thereof
Grant 10,157,953 - Huang , et al. Dec | 2018-12-18 |
Method of forming deep trench isolation in radiation sensing substrate and image sensor device
Grant 10,134,801 - Lu , et al. November 20, 2 | 2018-11-20 |
Semiconductor Device And Method Of Forming The Same
App 20180261547 - LU; Chi-Ming ; et al. | 2018-09-13 |
Semiconductor structure and manufacturing method thereof
Grant 10,074,594 - Fang , et al. September 11, 2 | 2018-09-11 |
Through via structure for step coverage improvement
Grant 9,991,204 - Fang , et al. June 5, 2 | 2018-06-05 |
Method of manufacturing semiconductor device with recess
Grant 9,859,124 - Fang , et al. January 2, 2 | 2018-01-02 |
Barrier layer and structure method
Grant 9,847,296 - Chang , et al. December 19, 2 | 2017-12-19 |
Block Layer in the Metal Gate of MOS Devices
App 20170323940 - Tsao; Jung-Chih ; et al. | 2017-11-09 |
Method Of Forming Semiconductor Device
App 20170317134 - LU; Chi-Ming ; et al. | 2017-11-02 |
Image Sensing Device And Manufacturing Method Thereof
App 20170294473 - HUANG; CHIH-CHANG ; et al. | 2017-10-12 |
Through Via Structure For Step Coverage Improvement
App 20170287841 - FANG; Li-Yen ; et al. | 2017-10-05 |
Block layer in the metal gate of MOS devices
Grant 9,735,231 - Tsao , et al. August 15, 2 | 2017-08-15 |
Through via structure for step coverage improvement
Grant 9,711,454 - Fang , et al. July 18, 2 | 2017-07-18 |
Image sensing device and manufacturing method thereof
Grant 9,691,804 - Huang , et al. June 27, 2 | 2017-06-27 |
Method Of Forming Deep Trench Isolation In Radiation Sensing Substrate And Image Sensor Device
App 20170154917 - LU; Chi-Ming ; et al. | 2017-06-01 |
Through Via Structure For Step Coverage Improvement
App 20170062343 - FANG; Li-Yen ; et al. | 2017-03-02 |
Image Sensing Device And Manufacturing Method Thereof
App 20160307952 - HUANG; CHIH-CHANG ; et al. | 2016-10-20 |
Semiconductor Structure And Manufacturing Method Thereof
App 20160307823 - FANG; LI-YEN ; et al. | 2016-10-20 |
Method Of Manufacturing Semiconductor Device With Recess
App 20160307761 - FANG; LI-YEN ; et al. | 2016-10-20 |
Block Layer In The Metal Gate Of Mos Devices
App 20150279838 - Tsao; Jung-Chih ; et al. | 2015-10-01 |
Barrier Layer and Structure Method
App 20150235954 - Chang; Chih-Chung ; et al. | 2015-08-20 |
Semiconductor Device And Formation Thereof
App 20150235953 - Tsao; Jung-Chih ; et al. | 2015-08-20 |
Semiconductor device
Grant 8,552,529 - Tsao , et al. October 8, 2 | 2013-10-08 |
Via/contact and damascene structures
Grant 8,531,036 - Chang , et al. September 10, 2 | 2013-09-10 |
Via/contact And Damascene Structures
App 20120292768 - Chang; Shih-Chieh ; et al. | 2012-11-22 |
Semiconductor Device
App 20120241908 - TSAO; Jung-Chih ; et al. | 2012-09-27 |
Via/contact and damascene structures and manufacturing methods thereof
Grant 8,247,322 - Chang , et al. August 21, 2 | 2012-08-21 |
Alpha tantalum capacitor plate
Grant 7,969,708 - Tsao , et al. June 28, 2 | 2011-06-28 |
Semiconductor Device
App 20100230815 - Tsao; Jung-Chih ; et al. | 2010-09-16 |
Apparatus and method for preventing copper peeling in ECP
Grant 7,667,835 - Cheng , et al. February 23, 2 | 2010-02-23 |
Alpha Tantalum Capacitor Plate
App 20090116169 - Tsao; Jung-Chih ; et al. | 2009-05-07 |
Method and apparatus for stabilizing plating film impurities
Grant 7,481,910 - Feng , et al. January 27, 2 | 2009-01-27 |
Semiconductor Device
App 20080251889 - Tsao; Jung-Chih ; et al. | 2008-10-16 |
Post ECP multi-step anneal/H.sub.2 treatment to reduce film impurity
Grant 7,432,192 - Feng , et al. October 7, 2 | 2008-10-07 |
Via/contact And Damascene Structures And Manufacturing Methods Thereof
App 20080211106 - Chang; Shih-Chieh ; et al. | 2008-09-04 |
Via structure and process for forming the same
Grant 7,417,321 - Tsao , et al. August 26, 2 | 2008-08-26 |
Multi-layer interconnect structure for semiconductor devices
Grant 7,368,379 - Tsao , et al. May 6, 2 | 2008-05-06 |
Apparatus and method for preventing copper peeling in ECP
App 20080047827 - Cheng; Hsi-Kuei ; et al. | 2008-02-28 |
Barrier layer for semiconductor interconnect structure
App 20070257366 - Wang; Yu-Sheng ; et al. | 2007-11-08 |
Semiconductor Devices And Fabrication Method Thereof
App 20070252277 - Tsao; Jung-Chih ; et al. | 2007-11-01 |
Dual contact ring and method for metal ECP process
Grant 7,252,750 - Liu , et al. August 7, 2 | 2007-08-07 |
Via structure and process for forming the same
App 20070152342 - Tsao; Jung-Chih ; et al. | 2007-07-05 |
Semiconductor device
App 20070126120 - Tsao; Jung-Chih ; et al. | 2007-06-07 |
Method to reduce Rs pattern dependence effect
Grant 7,208,404 - Tsao , et al. April 24, 2 | 2007-04-24 |
Metal-filled openings for submicron devices and methods of manufacture thereof
Grant 7,199,045 - Liu , et al. April 3, 2 | 2007-04-03 |
Method and apparatus for copper film quality enhancement with two-step deposition
Grant 7,189,650 - Liu , et al. March 13, 2 | 2007-03-13 |
Method of reducing the pattern effect in the CMP process
Grant 7,183,199 - Liu , et al. February 27, 2 | 2007-02-27 |
Interconnect structure for semiconductor devices
App 20070034517 - Tsao; Jung-Chih ; et al. | 2007-02-15 |
Method for preventing voids in metal interconnects
Grant 7,122,471 - Tsao , et al. October 17, 2 | 2006-10-17 |
Method for fabricating metal layer
App 20060219566 - Cheng; Hsi-Kuei ; et al. | 2006-10-05 |
Post ECP multi-step anneal/H2 treatment to reduce film impurity
App 20060216930 - Feng; Hsien-Ping ; et al. | 2006-09-28 |
Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process
Grant 7,071,100 - Chen , et al. July 4, 2 | 2006-07-04 |
Method and apparatus for copper film quality enhancement with two-step deposition
App 20060105565 - Liu; Chi-Wen ; et al. | 2006-05-18 |
Post ECP multi-step anneal/H2 treatment to reduce film impurity
Grant 7,030,016 - Feng , et al. April 18, 2 | 2006-04-18 |
Method and apparatus for stabilizing plating film impurities
App 20060000717 - Feng; Hsien-Ping ; et al. | 2006-01-05 |
Metal-filled openings for submicron devices and methods of manufacture thereof
App 20050275941 - Liu, Chi-Wen ; et al. | 2005-12-15 |
Method of fabricating inlaid structure
App 20050255642 - Liu, Chi-Wen ; et al. | 2005-11-17 |
Method for preventing voids in metal interconnects
App 20050245064 - Tsao, Jung-Chih ; et al. | 2005-11-03 |
Post ECP multi-step anneal/H2 treatment to reduce film impurity
App 20050227479 - Feng, Hsien-Ping ; et al. | 2005-10-13 |
Method of forming barrier layer with reduced resistivity and improved reliability in copper damascene process
App 20050191855 - Chen, Kei-Wei ; et al. | 2005-09-01 |
Thrust pad assembly for ECP system
App 20050121329 - Tsao, Jung-Chih ; et al. | 2005-06-09 |
Method of reducing the pattern effect in the CMP process
App 20050118808 - Liu, Chi-Wen ; et al. | 2005-06-02 |
Novel method to reduce Rs pattern dependence effect
App 20050085066 - Tsao, Jung-Chih ; et al. | 2005-04-21 |
Dual contact ring and method for metal ECP process
App 20050056544 - Liu, Chi-Wen ; et al. | 2005-03-17 |
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