Tsao; Chang-Chen
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tsao; Chang-Chen.The latest application filed is for "simultaneous bonding approach for high quality wafer stacking applications".
- Tsao; Chang-Chen - Tainan City TW
- Tsao; Chang-Chen - Tainan TW
- TSAO; Chang-Chen - Hsin-Chu TW
| Patent | Date |
|---|---|
| Simultaneous Bonding Approach For High Quality Wafer Stacking Applications App 20210335646 - Huang; Xin-Hua ; et al. | 2021-10-28 |
| Simultaneous bonding approach for high quality wafer stacking applications Grant 11,094,575 - Huang , et al. August 17, 2 | 2021-08-17 |
| Fully Automated Wafer Debonding System And Method Thereof App 20210242043 - Yu; Cheng-Fei ; et al. | 2021-08-05 |
| Wafer debonding system and method Grant 10,889,097 - Tsao , et al. January 12, 2 | 2021-01-12 |
| Simultaneous Bonding Approach For High Quality Wafer Stacking Applications App 20200381283 - Huang; Xin-Hua ; et al. | 2020-12-03 |
| Wafer Debonding System And Method App 20200108592 - Tsao; Chang-Chen ; et al. | 2020-04-09 |
| Wafer debonding system and method Grant 10,569,520 - Tsao , et al. Feb | 2020-02-25 |
| Wafer Debonding System And Method App 20190118522 - Tsao; Chang-Chen ; et al. | 2019-04-25 |
| Wafer debonding system and method Grant 10,155,369 - Tsao , et al. Dec | 2018-12-18 |
| Wafer Debonding System And Method App 20180147825 - Tsao; Chang-Chen ; et al. | 2018-05-31 |
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