Tsang Yang; Cornelia
Patent Applications and Registrations
Patent applications and USPTO patent grants for Tsang Yang; Cornelia.The latest application filed is for "device layer thin-film transfer to thermally conductive substrate".
- Tsang Yang; Cornelia - Medford MA
| Patent | Date |
|---|---|
| Wafer level integration including design/co-design, structure process, equipment stress management, and thermal management Grant 10,811,305 - Hung , et al. October 20, 2 | 2020-10-20 |
| Device layer thin-film transfer to thermally conductive substrate Grant 10,396,220 - Dang , et al. A | 2019-08-27 |
| Device Layer Thin-film Transfer To Thermally Conductive Substrate App 20190148564 - DANG; Bing ; et al. | 2019-05-16 |
| Device layer thin-film transfer to thermally conductive substrate Grant 10,243,091 - Dang , et al. | 2019-03-26 |
| Device Layer Thin-film Transfer To Thermally Conductive Substrate App 20180226516 - DANG; Bing ; et al. | 2018-08-09 |
| Wafer Level Integration Including Design/co-design, Structure Process, Equipment Stress Management, And Thermal Management App 20180082888 - HUNG; Li-Wen ; et al. | 2018-03-22 |
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