Tsang; Cornelia Kang-I

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsang; Cornelia Kang-I.The latest application filed is for "double layer release temporary bond and debond processes and systems".

Company Profile

1.27.23

Tsang; Cornelia Kang-I - Medford CT
Tsang; Cornelia Kang-I - Mohegan Lake NY
Tsang; Cornelia Kang-I - Mohegan NY
Tsang; Cornelia Kang-I - Yorktown Heights NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Handler bonding and debonding for semiconductor dies Grant 11,424,152 - Andry , et al. August 23, 2	2022-08-23
Double layer release temporary bond and debond processes and systems Grant 10,381,255 - Andry , et al. A	2019-08-13
Wafer debonding using mid-wavelength infrared radiation ablation Grant 10,297,479 - Dang , et al.	2019-05-21
Double Layer Release Temporary Bond And Debond Processes And Systems App 20190115243 - Andry; Paul S. ; et al.	2019-04-18
Double layer release temporary bond and debond processes and systems Grant 10,224,229 - Andry , et al.	2019-03-05
Integration of area efficient antennas for phased array or wafer scale array antenna applications Grant 10,103,450 - Dang , et al. October 16, 2	2018-10-16
Test probe substrate Grant 9,897,627 - Dang , et al. February 20, 2	2018-02-20
Test probe substrate Grant 9,851,379 - Dang , et al. December 26, 2	2017-12-26
Test Probe Substrate App 20170199227 - Dang; Bing ; et al.	2017-07-13
Test Probe Substrate App 20170199222 - Dang; Bing ; et al.	2017-07-13
Wafer Debonding Using Mid-wavelength Infrared Radiation Ablation App 20170125268 - Dang; Bing ; et al.	2017-05-04
Wafer debonding using mid-wavelength infrared radiation ablation Grant 9,636,782 - Dang , et al. May 2, 2	2017-05-02
Test probe substrate Grant 9,606,142 - Dang , et al. March 28, 2	2017-03-28
Adhesives for bonding handler wafers to device wafers and enabling mid-wavelength infrared laser ablation release Grant 9,586,291 - Dang , et al. March 7, 2	2017-03-07
Integration Of Area Efficient Antennas For Phased Array Or Wafer Scale Array Antenna Applications App 20160352023 - Dang; Bing ; et al.	2016-12-01
Double Layer Release Temporary Bond and Debond Processes and Systems App 20160329233 - Andry; Paul S. ; et al.	2016-11-10
Integration of area efficient antennas for phased array or wafer scale array antenna applications Grant 9,472,859 - Dang , et al. October 18, 2	2016-10-18
Multi-layer Laser Debonding Structure With Tunable Absorption App 20160133497 - Andry; Paul S. ; et al.	2016-05-12
Multi-layer Laser Debonding Structure With Tunable Absorption App 20160133495 - Andry; Paul S. ; et al.	2016-05-12
Double Layer Release Temporary Bond and Debond Processes and Systems App 20160133486 - Andry; Paul S. ; et al.	2016-05-12
Test Probe Substrate App 20160084876 - Dang; Bing ; et al.	2016-03-24
Wafer debonding using long-wavelength infrared radiation ablation Grant 9,269,561 - Dang , et al. February 23, 2	2016-02-23
Integration Of Area Efficient Antennas For Phased Array Or Wafer Scale Array Antenna Applications App 20150340765 - Dang; Bing ; et al.	2015-11-26
Wafer Debonding Using Mid-wavelength Infrared Radiation Ablation App 20150035554 - Dang; Bing ; et al.	2015-02-05
Adhesives For Bonding Handler Wafers To Device Wafers And Enabling Mid-wavelength Infrared Laser Ablation Release App 20150035173 - Dang; Bing ; et al.	2015-02-05
Silicon chicklet pedestal Grant 8,806,740 - Chey , et al. August 19, 2	2014-08-19
Wafer Debonding Using Long-wavelength Infrared Radiation Ablation App 20140144593 - Dang; Bing ; et al.	2014-05-29
Wafer Debonding Using Long-wavelength Infrared Radiation Ablation App 20140147986 - Dang; Bing ; et al.	2014-05-29
Through silicon via and method of fabricating same Grant 8,735,251 - Andry , et al. May 27, 2	2014-05-27
Through Silicon Via And Method Of Fabricating Same App 20140094007 - Andry; Paul Stephen ; et al.	2014-04-03
Through silicon via for use in integrated circuit chips Grant 8,637,937 - Andry , et al. January 28, 2	2014-01-28
Silicon chicklet pedestal Grant 8,595,919 - Chey , et al. December 3, 2	2013-12-03
Through Silicon Via And Method Of Fabricating Same App 20120132967 - Andry; Paul Stephen ; et al.	2012-05-31
Through silicon via and method of fabricating same Grant 8,138,036 - Andry , et al. March 20, 2	2012-03-20
Method of forming silicon chicklet pedestal Grant 7,987,591 - Chey , et al. August 2, 2	2011-08-02
Versatile Si-based packaging with integrated passive components for mmWave applications Grant 7,808,798 - Cotte , et al. October 5, 2	2010-10-05
Integrated module for data processing system Grant 7,750,459 - Dang , et al. July 6, 2	2010-07-06
Through-wafer vias Grant 7,741,722 - Andry , et al. June 22, 2	2010-06-22
Method of making through wafer vias Grant 7,678,696 - Andry , et al. March 16, 2	2010-03-16
Through Silicon Via And Method Of Fabricating Same App 20100032764 - Andry; Paul Stephen ; et al.	2010-02-11
Method Of Making Through Wafer Vias App 20100035430 - Andry; Paul Stephen ; et al.	2010-02-11
Integrated Module For Data Processing System App 20090194864 - Dang; Bing ; et al.	2009-08-06
Versatile Si-based packaging with integrated passive components for mmWave applications Grant 7,518,229 - Cotte , et al. April 14, 2	2009-04-14
Through-wafer Vias App 20080274583 - Andry; Paul Stephen ; et al.	2008-11-06
Versatile Si-based packaging with integrated passive components for mmWave applications App 20080029886 - Cotte; John Michael ; et al.	2008-02-07
Deep filled vias Grant 7,060,624 - Andricacos , et al. June 13, 2	2006-06-13
Deep filled vias App 20050037608 - Andricacos, Panayotis ; et al.	2005-02-17