Tsai; Yun-Lung

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Yun-Lung.The latest application filed is for "cartridge for bioreactor".

Company Profile

2.7.10

Tsai; Yun-Lung - Taichung TW
TSAI; Yun-Lung - Taichung City TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Portable bioreactor Grant 11,414,638 - Yang , et al. August 16, 2	2022-08-16
Cartridge For Bioreactor App 20220176372 - YANG; Wen-Shan ; et al.	2022-06-09
Heating mechanism for biochemical reaction device Grant 11,351,553 - Lee , et al. June 7, 2	2022-06-07
Portable Bioreactor App 20210147780 - YANG; Wen-Shan ; et al.	2021-05-20
Heating Mechanism For Biochemical Reaction Device App 20200156078 - LEE; Chun-Ming ; et al.	2020-05-21
Heating device and biochemical reactor having the same Grant 9,907,117 - Su , et al. February 27, 2	2018-02-27
Biochemical reactor Grant 9,731,296 - Su , et al. August 15, 2	2017-08-15
Heating Device And Biochemical Reactor Having The Same App 20160242237 - SU; CHEN ; et al.	2016-08-18
Biochemical Reactor App 20160175843 - SU; CHEN ; et al.	2016-06-23
Method For Detecting Bacillus Anthracis App 20140295435 - SU; Chen ; et al.	2014-10-02
Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant Grant 7,985,618 - Tsai , et al. July 26, 2	2011-07-26
Semiconductor Device Has Encapsulant With Chamfer Such That Portion Of Substrate And Chamfer Are Exposed From Encapsulant And Remaining Portion Of Surface Of Substrate Is Covered By Encapsulant App 20110129966 - Tsai; Yun-Lung ; et al.	2011-06-02
Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant Grant 7,884,456 - Tsai , et al. February 8, 2	2011-02-08
Semiconductor Device Has Encapsulant With Chamfer Such That Portion Of Substrate And Chamfer Are Exposed From Encapsulant And Remaining Portion Of Surface Of Substrate Is Covered By Encapsulant App 20090008760 - Tsai; Yun-Lung ; et al.	2009-01-08
Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant Grant 7,443,016 - Tsai , et al. October 28, 2	2008-10-28
Circuit board and package structure thereof App 20070166884 - Li; Hao Wei ; et al.	2007-07-19
Semiconductor Device For Accommodating Large Chips, Fabrication Method Thereof, And Carrier Used In The Semiconductor Device App 20060273442 - Tsai; Yun-Lung ; et al.	2006-12-07

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