TSAI; Yu-Ping
Patent Applications and Registrations
Patent applications and USPTO patent grants for TSAI; Yu-Ping.The latest application filed is for "semiconductor package structure and method of manufacturing the same".
- TSAI; Yu-Ping - Kaohsiung TW
- TSAI; YU-PING - Taipei City TW
- Tsai; Yu-Ping - Tamshui Chen TW
- Tsai; Yu-Ping - Changhua TW
- Tsai; Yu-Ping - Changhua City TW
| Patent | Date |
|---|---|
| Semiconductor Package Structure And Method Of Manufacturing The Same App 20210407951 - TSAI; Yu-Ping ; et al. | 2021-12-30 |
| Optical Fiber With Image Enhancement App 20150378094 - LU; LUKE ; et al. | 2015-12-31 |
| Optical Fiber With Image Enhancement App 20150043876 - LU; LUKE ; et al. | 2015-02-12 |
| Power supply and retention bar for a power supply Grant 7,850,478 - Lin , et al. December 14, 2 | 2010-12-14 |
| Power supply and retention bar for a power supply App 20100105232 - Lin; Tien-Wen ; et al. | 2010-04-29 |
| Method of preparing a copolymer and using such as a dispersing agent for titanate-based ceramic colloids Grant 7,572,836 - Hsu , et al. August 11, 2 | 2009-08-11 |
| Method of preparing a copolymer and using such as a dispersing agent for titanate-based ceramic colloids App 20070060657 - Hsu; Kung-Chung ; et al. | 2007-03-15 |
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