TSAI; Yu-Pin

Patent Applications and Registrations

Patent applications and USPTO patent grants for TSAI; Yu-Pin.The latest application filed is for "semiconductor package structure and method for manufacturing the same".

Company Profile

6.13.21

TSAI; Yu-Pin - Kaohsiung TW
TSAI; Yu-Pin - Kaohsiung City TW
Tsai; Yu-Pin - Kao-Hsiung City TW
Tsai; Yu-Pin - Kaoshiung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Package Structure And Method For Manufacturing The Same App 20220181268 - KUNG; Cheng-Yuan ; et al.	2022-06-09
Optical Device And Method Of Manufacturing The Same App 20220020885 - TSAI; Yu-Pin ; et al.	2022-01-20
Optical device and method of manufacturing the same Grant 11,133,423 - Tsai , et al. September 28, 2	2021-09-28
Semiconductor package structure and method of manufacturing the same Grant 11,121,111 - Tsai , et al. September 14, 2	2021-09-14
Semiconductor package structure and method for manufacturing the same Grant 11,088,057 - Tsai , et al. August 10, 2	2021-08-10
Semiconductor Package Structure And Method Of Manufacturing The Same App 20210074664 - TSAI; Yu-Pin ; et al.	2021-03-11
Optical Device And Method Of Manufacturing The Same App 20210005761 - TSAI; Yu-Pin ; et al.	2021-01-07
Method for manufacturing a semiconductor device package Grant 10,879,215 - Lyu , et al. December 29, 2	2020-12-29
Semiconductor Package Structure And Method For Manufacturing The Same App 20200357730 - TSAI; Yu-Pin ; et al.	2020-11-12
Semiconductor process Grant 10,395,997 - Tsao , et al. A	2019-08-27
Semiconductor Device Package And A Method Of Manufacturing The Same App 20190206843 - LYU; Li-Hao ; et al.	2019-07-04
Semiconductor device package and a method of manufacturing the same Grant 10,269,771 - Lyu , et al.	2019-04-23
Semiconductor device package and a method of manufacturing the same Grant 10,037,975 - Hsieh , et al. July 31, 2	2018-07-31
Semiconductor Device Package And A Method Of Manufacturing The Same App 20180061727 - LYU; Li-Hao ; et al.	2018-03-01
Semiconductor Device Package And A Method Of Manufacturing The Same App 20180061813 - HSIEH; Wei-Ming ; et al.	2018-03-01
Semiconductor Process App 20170125310 - TSAO; Yu-Cheng ; et al.	2017-05-04
Semiconductor Process App 20150132867 - TSAO; Yu-Cheng ; et al.	2015-05-14
Wafer laser-making method and die fabricated using the same Grant 8,728,915 - Tsai , et al. May 20, 2	2014-05-20
Wafer Laser-marking Method And Die Fabricated Using The Same App 20110316122 - TSAI; Yu-Pin ; et al.	2011-12-29
Stacked Semiconductor Device Package Assemblies with Reduced Wire Sweep and Manufacturing Methods Thereof App 20110241194 - Chen; Chia-Ching ; et al.	2011-10-06
Chip package, chip packaging, chip carrier and process thereof Grant 7,842,597 - Tsai November 30, 2	2010-11-30
Wafer Laser-marking Method And Die Fabricated Using The Same App 20100001416 - Tsai; Yu-Pin ; et al.	2010-01-07
Stacked structure of chips and water structure for making the same Grant 7,560,818 - Tsai July 14, 2	2009-07-14
Fabricating method of wafer protection layers Grant 7,510,909 - Tsai March 31, 2	2009-03-31
Method of thinning a wafer App 20080200037 - Tsai; Yu-Pin ; et al.	2008-08-21
Chip Scale Package And Method For Marking Chip Scale Packages App 20080132000 - TSAI; Yu Pin ; et al.	2008-06-05
Stacked structure of chips and wafer structure for making the same App 20080048323 - Tsai; Yu-Pin	2008-02-28
Method for Manufacturing Chip Package Structures App 20070155049 - Tsai; Yu-Pin	2007-07-05
CIS Package and Method Thereof App 20060256222 - Tsai; Yu-Pin	2006-11-16
Chip Package, Chip Packaging, Chip Carrier And Process Thereof App 20060088955 - Tsai; Yu-Pin	2006-04-27
Fabricating Method Of Wafer Protection Layers App 20060057778 - Tsai; Yu-Pin	2006-03-16
Semiconductor wafer cassette Grant 6,691,876 - Tsai , et al. February 17, 2	2004-02-17
Semiconductor wafer cassette App 20030075518 - Tsai, Yu-Pin ; et al.	2003-04-24

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