TSAI; Yu-Fang
Patent Applications and Registrations
Patent applications and USPTO patent grants for TSAI; Yu-Fang.The latest application filed is for "optical device package".
- TSAI; Yu-Fang - Kaohsiung TW
- Tsai; Yu-Fang - Taipei TW
- Tsai; Yu-Fang - Kaohsiung City TW
- Tsai; Yu-Fang - Kaoshiung TW
| Patent | Date |
|---|---|
| Optical Device Package App 20220238502 - TSAI; Tsung-Yueh ; et al. | 2022-07-28 |
| Optical device package Grant 11,302,682 - Tsai , et al. April 12, 2 | 2022-04-12 |
| Dynamic page similarity measurement Grant 11,042,630 - Chen , et al. June 22, 2 | 2021-06-22 |
| Optical Device Package App 20210125974 - TSAI; Tsung-Yueh ; et al. | 2021-04-29 |
| Dynamic Page Similarity Measurement App 20200042696 - CHEN; Chao-Yu ; et al. | 2020-02-06 |
| Light-emitting semiconductor packages and related methods Grant 9,059,379 - Kuo , et al. June 16, 2 | 2015-06-16 |
| Semiconductor device packages with solder joint enhancement elements Grant 8,994,156 - Chiang , et al. March 31, 2 | 2015-03-31 |
| Light-emitting Semiconductor Packages And Related Methods App 20140117388 - Kuo; Yen-Ting ; et al. | 2014-05-01 |
| Semiconductor packages with lead extensions and related methods Grant 8,674,487 - Yu , et al. March 18, 2 | 2014-03-18 |
| Semiconductor Device Packages With Solder Joint Enhancement Element And Related Methods App 20130307157 - Chiang; Po-Shing ; et al. | 2013-11-21 |
| Semiconductor Packages With Lead Extensions And Related Methods App 20130241041 - Yu; Lin-Wang ; et al. | 2013-09-19 |
| Semiconductor device packages with solder joint enhancement element and related methods Grant 8,502,363 - Chiang , et al. August 6, 2 | 2013-08-06 |
| Semiconductor Device Packages With Solder Joint Enhancement Element And Related Methods App 20130009313 - Chiang; Po-Shing ; et al. | 2013-01-10 |
| Multi-chip Package Structure App 20070290318 - TAO; Su ; et al. | 2007-12-20 |
| Multi-chip package structure Grant 7,291,926 - Tao , et al. November 6, 2 | 2007-11-06 |
| Multi-chip package structure Grant 7,253,529 - Tao , et al. August 7, 2 | 2007-08-07 |
| Multi-chip package structure Grant 7,129,583 - Tao , et al. October 31, 2 | 2006-10-31 |
| Multi-chip package structure App 20060138631 - Tao; Su ; et al. | 2006-06-29 |
| Multi-chip package structure App 20060131718 - Tao; Su ; et al. | 2006-06-22 |
| Multi-chip package structure App 20060131717 - Tao; Su ; et al. | 2006-06-22 |
| Method for manufacturing a package Grant 7,037,750 - Tsai , et al. May 2, 2 | 2006-05-02 |
| Stacked chip-packaging structure Grant 7,026,709 - Tsai , et al. April 11, 2 | 2006-04-11 |
| Manufacturing method of ball grid array package Grant 7,015,065 - Tsai , et al. March 21, 2 | 2006-03-21 |
| Multi-chip package structure App 20060055019 - Tao; Su ; et al. | 2006-03-16 |
| Multi-chip package structure App 20050139979 - Tao, Su ; et al. | 2005-06-30 |
| Multi-chip package structure App 20050140022 - Tao, Su ; et al. | 2005-06-30 |
| Manufacturing method of ball grid array package App 20050090043 - Tsai, Yu-Fang ; et al. | 2005-04-28 |
| Stacked Chip-packaging Structure App 20050023657 - Tsai, Yu-Fang ; et al. | 2005-02-03 |
| Method for manufacturing a package App 20040161879 - Tsai, Yu-Fang ; et al. | 2004-08-19 |
| Structure of a ball bump for wire bonding and the formation thereof App 20010022315 - Tsai, Yu-Fang ; et al. | 2001-09-20 |
| Structure of a ball bump for wire bonding and the formation thereof Grant 6,244,499 - Tsai , et al. June 12, 2 | 2001-06-12 |
uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.
While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.
All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.
| 