Tsai; Yu-Chieh

Patent Applications and Registrations

Patent applications and USPTO patent grants for Tsai; Yu-Chieh.The latest application filed is for "method, system, computer program product and computer-readable storage medium for creating an augmented reality environment".

Company Profile

1.5.8

Tsai; Yu-Chieh - Taipei TW
TSAI; Yu-Chieh - Taipei City TW
Tsai; Yu-Chieh - Hsin-Chu TW
Tsai; Yu-Chieh - Taichung TW

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Robotic fish Grant 11,192,619 - Yao , et al. December 7, 2	2021-12-07
Robotic Fish App 20210276678 - YAO; Leeh-Ter ; et al.	2021-09-09
Method, System, Computer Program Product And Computer-readable Storage Medium For Creating An Augmented Reality Environment App 20210279965 - YAO; Leeh-Ter ; et al.	2021-09-09
Image Display Device, Three-dimensional Image Processing Circuit And Synchronization Signal Correction Method Thereof App 20210006768 - Peng; Chih-Hsun ; et al.	2021-01-07
Boot method and boot system Grant 9,507,604 - Huang , et al. November 29, 2	2016-11-29
Boot Method And Boot System App 20150074386 - HUANG; Yi Fang ; et al.	2015-03-12
Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant Grant 7,985,618 - Tsai , et al. July 26, 2	2011-07-26
Semiconductor Device Has Encapsulant With Chamfer Such That Portion Of Substrate And Chamfer Are Exposed From Encapsulant And Remaining Portion Of Surface Of Substrate Is Covered By Encapsulant App 20110129966 - Tsai; Yun-Lung ; et al.	2011-06-02
Semiconductor device has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant Grant 7,884,456 - Tsai , et al. February 8, 2	2011-02-08
Semiconductor Device Has Encapsulant With Chamfer Such That Portion Of Substrate And Chamfer Are Exposed From Encapsulant And Remaining Portion Of Surface Of Substrate Is Covered By Encapsulant App 20090008760 - Tsai; Yun-Lung ; et al.	2009-01-08
Semiconductor device for use as multimedia memory card, has encapsulant with chamfer such that portion of substrate and chamfer are exposed from encapsulant and remaining portion of surface of substrate is covered by encapsulant Grant 7,443,016 - Tsai , et al. October 28, 2	2008-10-28
Semiconductor package, array arranged substrate structure for the semiconductor package and fabrication method of the semiconductor package App 20070243666 - Huang; Chien-Ping ; et al.	2007-10-18
Semiconductor Device For Accommodating Large Chips, Fabrication Method Thereof, And Carrier Used In The Semiconductor Device App 20060273442 - Tsai; Yun-Lung ; et al.	2006-12-07

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